MT6M15962a
© Fuji Electric Co., Ltd. All rights reserved.
6-7
5. Others
5.1 Precautions for use
①
When using the IPM and installing it on the equipment, please refer to the IPM specifications as well.
②
Please install a fuse or circuit breaker with sufficient capacity between the input AC power line and
the system to prevent secondary destruction in consideration of a destruction of IGBTs/FWDs .
③
Ensure that the switching trajectory at turn-off shall not exceed the RBSOA specification. In addition,
the IPM does not define SCSOA because it has a built-in short circuit protection function that
detects short circuit current and turns itself off before failure. Ensure that the surge voltage shall not
exceed the absolute maximum rating.
④
Before using the product, grasp the environment in which the product will be used and ensure that
the reliability of the IPM meets your requirements. If the product is used beyond the specifications, it
may cause a malfunction before its design life.
⑤
Even if the product is used within the maximum rating, the product life may vary depending on the
temperature and usage environment. Please use it after fully considering the product life and usage
environment.
⑥
If the IPM is restarted with a broken power chip, the protection function will not operate properly,
which may result in a large-scale destruction. Do not restart the broken IPM.
4. Power cycling capability
• The lifetime of semiconductor products is not permanent. Note that thermal fatigue caused by
temperature rise/drop restricts the lifetime. If temperature rise and drop occur continuously, the
reduction of the temperature change is required.
• The thermal fatigue life due to temperature changes is called the power cycling capability (withstand
capacity), and there are the following two patterns.
①
Δ
T
vj
power cycling capability : Lifetime caused by chip temperature change that occurs in a
relatively short cycle (Mainly due to deterioration of the wire junction on the chip surface)
Please refer to MT6M15364 for
the Δ
T
vj
power cycling capability curves.
②
Δ
T
c
power cycling capability : Lifetime caused by copper base plate temperature (
T
c
) change that
occurs in a relatively long cycle (Mainly due to deterioration of solder joint part between the
insulated substrate DCB and copper base)
Please refer to MT5F39952 for the Δ
T
c
power cycling capability curves.
• Please refer to Chapter 11 "Reliability of power modules" in Fuji IGBT Module Application Manual
(REH984).
