MT6M15962a
© Fuji Electric Co., Ltd. All rights reserved.
5-7
Fig.5-4 Measuring the case temperature
3.5 Verification of chip temperature
After selecting a heat sink and the IPM mounting position is decided, measure the
T
c
(directly below
the chip) and
T
f
(directly below the chip), and verify the chip junction temperature (
T
vj
).
Figure 5-4 shows an example of how to accurately measure the case temperature (
T
c
). Please
measure the case temperature directly below the chip. The chip location is described in the
specification.
Please verify that the case temperature does not exceed 125
°
C, the chip junction temperature does
not exceed 175
°
C and the thermal design meets the required life time of the system.
T
c
T
f
