Appendix B Package Information
MC9S12XE-Family Reference Manual , Rev. 1.19
1258
Freescale Semiconductor
B.1
208 MAPBGA
Figure B-1. 208MAPBGA Mechanical Dimensions
B.2
144-Pin LQFP
K
M
M
E
D
0.2
4X
X
LASER MARK FOR PIN A1
IDENTIFICATION IN THIS AREA
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
15X e
X
S
0.3
M
Y
X
Z
0.1
M
Z
208X
b
3
METALIZED MARK FOR PIN A1
IDENTIFICATION IN THIS AREA
15X e
S
VIEW M M
VIEW K
(ROTATED 90° CLOCKWISE)
0.2 Z
5
0.2
208X
Z
Z
4
A
A1
A2
CASE 1159A-01
ISSUE B
DATE 12/12/98
DIM
MIN
MAX
MILLIMETERS
A
---
2.00
A1
0.40
0.60
A2
1.00
1.30
b
0.50
0.70
D
17.00 BSC
E
17.00 BSC
e
1.00 BSC
S
0.50 BSC
NOTES:
1.
2.
3.
4.
5.
ALL DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
PARALLELISM MEASEMENT SHALL EXCLUDE ANY
EFFECT OF MARK ON TOP SURFACE OF PACKAGE.
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
S12XE
products
in
208
MAPBGA
packages