52
System Testing & Troubleshooting
DI
AG
NO
S
T
IC
DI
S
P
L
A
Y
E
D
RE
AS
O
N
F
O
R DI
AG
NO
S
T
IC
UCM
’S
RE
ACT
IO
N
RE
S
E
T
RE
Q
U
IR
E
D
E
v
apor
at
or
E
n
te
ri
ng S
o
lut
ion
T
e
m
p
er
at
ur
e S
e
ns
or
F
a
il
P
roblem
: T
h
e E
v
apor
at
or
E
n
te
ri
ng
S
o
lut
ion T
e
m
p
er
at
ur
e S
e
ns
or
input
is
out
of
r
a
nge.
Chec
k
: S
ens
or
r
e
s
is
tanc
e bet
w
een
830 ohm
s
(
2
00 F
) and 345.
7K
ohm
s
(-
40 F
).
I
f s
o
, c
hec
k
f
ield/
unit
wir
ing
bet
w
een S
ens
or
and CG
M
.
T
he unit
is
r
e
ading a s
ignal t
h
at
is
out
of
r
a
nge f
o
r t
h
is
input
on t
he CG
M
.
(T
em
p <
-
4
0 F
or
T
e
m
p
>
200 F
).
W
hen t
h
is
diagnos
ti
c
is
ac
ti
v
e
:
a.
A
"
Loc
k
out
Ck
ts
" r
eques
t is
s
e
nt
to
t
h
e c
o
m
p
re
s
s
or
s
taging f
unc
ti
on.
A
ll Com
p
re
s
s
or
Relay
s
, LP
C
B
y
pas
s
r
e
lay
s
, and Liquid Line
S
o
lenoids
will be de-
ener
g
iz
ed.
M
in
On
ti
m
e
s
, H
G
B
P
, a
n
d
P
u
m
p
down will be by
pas
s
ed.
b.
I
f Leav
ing S
o
lut
ion Res
e
t t
y
pe
s
e
le
c
te
d
i
s
E
n
te
ri
n
g
S
o
lu
ti
o
n
R
e
s
e
t,
th
e
n
th
e
R
e
s
e
t ty
p
e
r
e
v
e
rt
s
to
NO
NE
f
o
r t
h
e dur
a
ti
on of
t
h
e f
a
ilur
e.
c
. E
v
apor
at
or
S
o
lut
ion P
u
m
p
C
o
n
tr
o
l i
s
n
o
t a
ffe
c
te
d
.
d.
T
he Heat
T
a
pe r
e
lay
out
put
will
e
n
e
rg
iz
e
.
(P
M
R
) A
m
a
nual r
e
s
e
t is
re
quir
ed af
te
r t
h
is
diagnos
ti
c
oc
c
u
rs
. T
he Diagnos
ti
c
c
a
n
be r
e
s
e
t by
t
he unit
m
o
unt
ed
Hum
a
n I
n
te
rf
ac
e M
o
dule or
T
rac
er
, or
by
c
y
c
ling power
to
th
e
C
G
M
.
E
v
apor
at
or
Leav
ing S
o
lut
ion
T
e
m
p
er
at
ur
e S
e
ns
or
F
a
il
P
roblem
: T
h
e E
v
apor
at
or
Leav
ing
S
o
lut
ion T
e
m
p
er
at
ur
e s
e
ns
or
input
is
out
of
r
a
nge.
Chec
k
: S
ens
or
r
e
s
is
tanc
e bet
w
een
830 ohm
s
(
2
00 F
) and 345.
7K
ohm
s
(-
40 F
).
I
f s
o
, c
hec
k
f
ield/
unit
wir
ing
bet
w
een S
ens
or
and CG
M
.
T
he unit
is
r
e
ading a s
ignal t
h
at
is
out
of
r
a
nge f
o
r t
h
is
input
on t
he CG
M
(T
em
p <
-
4
0 F
or
T
e
m
p
>
200 F
).
W
hen t
h
is
diagnos
ti
c
is
ac
ti
v
e
:
a.
A
"
Loc
k
out
Ck
ts
" r
eques
t is
s
e
nt
to
t
h
e c
o
m
p
re
s
s
or
s
taging f
unc
ti
on.
A
ll Com
p
re
s
s
or
Relay
s
, LP
C
B
y
pas
s
r
e
lay
s
, and Liquid Line
S
o
lenoids
will be de-
ener
g
iz
ed.
M
in
On
ti
m
e
s
, H
G
B
P
, a
n
d
P
u
m
p
down will be by
pas
s
ed.
b.
T
he f
o
llowing f
unc
ti
ons
will be
dis
a
bled:
1)
Com
p
re
s
s
o
r S
taging,
2)
P
roc
es
s
/Com
for
t Cooling,
3)
I
c
e B
u
ilding.
c
. E
v
apor
at
or
S
o
lut
ion P
u
m
p
C
o
n
tr
o
l i
s
n
o
t a
ffe
c
te
d
.
d.
T
he Heat
T
a
pe r
e
lay
out
put
will
e
n
e
rg
iz
e
.
(P
M
R
) A
m
a
nual r
e
s
e
t is
re
quir
ed af
te
r t
h
is
diagnos
ti
c
oc
c
u
rs
. T
he Diagnos
ti
c
c
a
n
be r
e
s
e
t by
t
he unit
m
o
unt
ed
Hum
a
n I
n
te
rf
ac
e M
o
dule or
T
rac
er
, or
by
c
y
c
ling power
to
th
e
C
G
M
.
Summary of Contents for IntelliPak CGAF Series
Page 68: ...68...