EMA_CLK
EMA_BA[1:0]
EMA_CS[0]
EMA_CAS
EMA_RAS
EMA_WE
CLK
CE
WE
EMIFA
SDRAM
2M x 16 x 4
Bank
EMA_SDCKE
CAS
RAS
CKE
BA[1:0]
LDQM
UDQM
DQ[15:0]
A[11:0]
EMA_A[12:0]
EMA_WE_DQM[0]
EMA_WE_DQM[1]
EMA_D[15:0]
EMA_CS[2]
EMA_CS[3]
EMA_WAIT
EMA_OE
GPIO
(6 Pins)
RESET
A[0]
A[12:1]
DQ[15:0]
CE
WE
OE
RESET
A[18:13]
RY/ Y
B
NOR
FLASH
512K x 16
ALE
CLE
DQ[15:0]
CE
WE
RE
RB
NAND
FLASH
1Gb x 16
EMA_BA[1]
EMA_A[1]
EMA_A[2]
...
D
VDD
RESET
OMAP-L137
SPRS563G – SEPTEMBER 2008 – REVISED JUNE 2014
www.ti.com
A likely use case with more than one EMIFA chip select used for NAND flash is illustrated in
Figure 6-13
.
This figure shows how two multiplane NAND flash devices with two chip selects each would connect to the
EMIFA. In this case if NAND is the boot memory, then the boot image needs to be stored in the NAND
area selected by EMA_CS[3]. Part of the application image could spill over into the NAND regions
selected by other EMIFA chip selects; but would rely on the code stored in the EMA_CS[3] area to
bootload it.
Figure 6-12. OMAP-L137 Connection Diagram: SDRAM, NOR, NAND
86
Peripheral Information and Electrical Specifications
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