OMAP-L137
www.ti.com
SPRS563G – SEPTEMBER 2008 – REVISED JUNE 2014
Shows how to maintain coherence with external memory, how to use DMA to reduce
memory latencies, and how to optimize your code to improve cache efficiency. The internal
memory architecture in the C674x DSP is organized in a two-level hierarchy consisting of a
dedicated program cache (L1P) and a dedicated data cache (L1D) on the first level.
Accesses by the CPU to the these first level caches can complete without CPU pipeline
stalls. If the data requested by the CPU is not contained in cache, it is fetched from the next
lower memory level, L2 or external memory.
7.3
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's
Terms of Use
.
TI E2E™ Online Community
TI's
Engineer-to-Engineer
(E2E)
Community.
Created
to
foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki.
Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
7.4
Trademarks
DSP/BIOS, TMS320C6000, C6000, E2E are trademarks of Texas Instruments.
ARM926EJ-S, ETM9, CoreSight are trademarks of ARM Limited.
All other trademarks are the property of their respective owners.
7.5
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
7.6
Glossary
SLYZ022
—
TI Glossary
.
This glossary lists and explains terms, acronyms, and definitions.
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