OMAP-L137
www.ti.com
SPRS563G – SEPTEMBER 2008 – REVISED JUNE 2014
Table of Contents
1
OMAP-L137 Low-Power Applications Processor
.
1
6.10
External Memory Interface A (EMIFA)
..............
84
1.1
Features
..............................................
1
6.11
External Memory Interface B (EMIFB)
..............
95
1.2
Applications
...........................................
2
6.12
Memory Protection Units
..........................
103
1.3
Description
............................................
2
6.13
MMC / SD / SDIO (MMCSD)
.......................
106
1.4
Functional Block Diagram
............................
4
6.14
Ethernet Media Access Controller (EMAC)
........
109
2
Revision History
.........................................
6
6.15
Management Data Input/Output (MDIO)
...........
114
6.16
Multichannel Audio Serial Ports (McASP0, McASP1,
3
Device Overview
.........................................
8
and McASP2)
......................................
116
3.1
Device Characteristics
................................
8
6.17
Serial Peripheral Interface Ports (SPI0, SPI1)
.....
129
3.2
Device Compatibility
..................................
9
6.18
Enhanced Capture (eCAP) Peripheral
.............
148
3.3
ARM Subsystem
......................................
9
6.19
Enhanced Quadrature Encoder (eQEP)
3.4
DSP Subsystem
.....................................
12
Peripheral
..........................................
151
3.5
Memory Map Summary
.............................
23
6.20
Enhanced High-Resolution Pulse-Width Modulator
3.6
Pin Assignments
....................................
26
(eHRPWM)
.........................................
153
3.7
Terminal Functions
..................................
27
6.21
LCD Controller
.....................................
157
4
Device Configuration
..................................
48
6.22
Timers
..............................................
172
4.1
Boot Modes
.........................................
48
6.23
Inter-Integrated Circuit Serial Ports (I2C0, I2C1)
..
174
4.2
SYSCFG Module
....................................
49
6.24
Universal Asynchronous Receiver/Transmitter
(UART)
.............................................
179
4.3
Pullup/Pulldown Resistors
..........................
51
6.25
USB1 Host Controller Registers (USB1.1 OHCI)
..
181
5
Device Operating Conditions
........................
52
6.26
USB0 OTG (USB2.0 OTG)
........................
182
5.1
Absolute Maximum Ratings Over Operating Case
Temperature Range
6.27
Host-Port Interface (UHPI)
.........................
190
(Unless Otherwise Noted)
.................................
52
6.28
Power and Sleep Controller (PSC)
................
197
5.2
Handling Ratings
....................................
52
6.29
Programmable Real-Time Unit Subsystem
5.3
Recommended Operating Conditions
...............
53
(PRUSS)
...........................................
200
5.4
Notes on Recommended Power-On Hours (POH)
.
54
6.30
Emulation Logic
....................................
203
5.5
Electrical Characteristics Over Recommended
6.31
IEEE 1149.1 JTAG
................................
210
Ranges of Supply Voltage and Operating Case
6.32
Real Time Clock (RTC)
............................
212
Temperature (Unless Otherwise Noted)
............
55
7
Device and Documentation Support
..............
215
6
Peripheral Information and Electrical
7.1
Device Support
.....................................
215
Specifications
...........................................
56
7.2
Documentation Support
............................
216
6.1
Parameter Information
..............................
56
6.2
Recommended Clock and Control Signal Transition
7.3
Community Resources
.............................
217
Behavior
.............................................
57
7.4
Trademarks
........................................
217
6.3
Power Supplies
......................................
57
7.5
Electrostatic Discharge Caution
...................
217
6.4
Reset
................................................
58
7.6
Glossary
............................................
217
6.5
Crystal Oscillator or External Clock Input
...........
61
8
Mechanical Packaging and Orderable
6.6
Clock PLLs
..........................................
63
Information
.............................................
218
6.7
Interrupts
............................................
67
8.1
Thermal Data for ZKB
.............................
218
6.8
General-Purpose Input/Output (GPIO)
..............
76
8.2
Packaging Information
.............................
218
6.9
EDMA
...............................................
79
Copyright © 2008–2014, Texas Instruments Incorporated
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5
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