Sun Oracle Fire X4470 M2, Service Manual

Page: 103 / 194

Chapter 5 Servicing FRU Components 5-19
5.5 Servicing the Motherboard (FRU)
Use the following procedures to remove and install the motherboard.
Caution –
These procedures require that you handle components that are sensitive
to electrostatic discharge. This discharge can cause server components to fail. To
avoid damage, ensure that you follow the antistatic practices as described in
Section 2.3 “Performing Electrostatic Discharge and Static Prevention Measures” on
page 2-3
.
▼
Remove the Motherboard
Refer to
FIGURE 5-10
when completing the following procedure.
1. Prepare for servicing:
a. Attach an antistatic wrist strap.
See Section 2.3 “Performing Electrostatic Discharge and Static Prevention
Measures” on page 2-3 .
b. Power off the server completely and disconnect all power cords from the
server power supplies.
See Section 2.6 “Powering Off the Server” on page 2-6 .
c. Extend the server to the maintenance position.
See Section 2.4 “Positioning the Server for Maintenance” on page 2-4 .
d. Remove the top cover.
See Section 2.7 “Removing the Server Top Cover” on page 2-8 .
2. Remove the CPUs and heatsinks from the motherboard.
See Section 5.1 “Servicing the CPU and Heatsink (FRU)” on page 5-1
3. Remove all memory risers.
See “Remove a Memory Riser and DIMM” on page 4-9 .
4. Remove all PCIe cards from the server.
See “Remove a PCIe Card” on page 4-20 .
5. Loosen the green captive screw in the corner near the fans that secures the
motherboard to the chassis. See
FIGURE 5-10
.