6-11
6. Material List
- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -
- This Document can not be used without Samsung's authorization -
R530/R730
Level
Code
Assembled
EA
Description
Spec.
Service
......3
3711-000922 J516
1
HEADER-BOARD TO
CABLE
BOX,4P,1R,1.25mm,SMD-A,SN,WHT
......3
3711-002046 J501
1
HEADER-BOARD TO
CABLE
BOX,12P,1R,1.25mm,SMD-S,SN,WHT
......3
3711-007011 J503
1
HEADER-BATTERY
NOWALL,7P,1R,2.5mm,BATTERY TYPE,AU,BLK
......3
3722-002588 J520
1
JACK-PHONE
6P,AU,BLK,ANGLE
......3
3722-002588 J521
1
JACK-PHONE
6P,AU,BLK,ANGLE
......3
3722-002767 J519
1
JACK-USB
4P/1C,AU,BLK,ANGLE,A
......3
3722-002865 J511
1
JACK-MODULAR
8P/8C,STANDARD,N,SMD-A,GRN/YEL,Au,1PORT
......3
3722-002925 J502
1
JACK-USB
4P/2C,AUF,BLK,ANGLE-OFFSET,A,-
......3
3722-002997 J500
1
JACK-DC POWER
3P,5.6PI,AUF,BLK
......3
4309-001022 J522
1
BATTERY-HOLDER
CELL,PIN,25.4mm,28.45x19.30x4.98mm,TP,1.1g,1.1g
......3
BA09-00021A U504
1
IC MICOM
MEC1308-NU,-,128,3.3V,32.768KHz,Romless,16M,8,VTQFP,TRAY,
14mm*14mm*1.0mm,8,0~70,-,0,VTQFP,-
......3
BA41-01178A PCB
1
PCB MAIN
Bremen-UL,FR-4,6L,-,1.1T,w238*L210mm,-,-,-,OSP,NANYA,-
......3
BA61-01090A M500
1
SUPPORT-MINICARD
RIMINI,ALLOY,T1.5,W4.5,L1.5mm,NTR,-,-
......3
BA61-01090A M501
1
SUPPORT-MINICARD
RIMINI,ALLOY,T1.5,W4.5,L1.5mm,NTR,-,-
......3
BA68-03588A BIOS REV
1
LABEL-SPI
RIMINI,SEC,paper,-,W4.5,L4mm,white,white,SPI,Revsion,-,-,-
......3
BA68-10191W SMT_SN
1
LABEL-BARCODE
Note PC ALL,-,ARTPAPER,-,W6,L40mm,White,-,PCB-TOP/
BOTTOM,Barcode-SMT,-,-,-
......3
BA68-40012N MICOM_REV
1
LABEL-LOCATION
NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,-,-,-,-
......3
BA70-00606A EMI2
1
GASKET-EMI
SANTAFE,BERYLLIUM COPPER,T0.08,BRIGHT TIN,W3.0,-
,L2.0*H4.0mm,HV370-HV410
......3
BA81-07945B SMT1
1
LEAD-1005
NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
......3
BA81-07945B SMT10
1
LEAD-1005
NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
......3
BA81-07945B SMT2
1
LEAD-1005
NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
......3
BA81-07945B SMT5
1
LEAD-1005
NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
......3
BA81-07945B SMT6
1
LEAD-1005
NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
......3
BA81-07945B SMT7
1
LEAD-1005
NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
......3
BA81-07945B SMT8
1
LEAD-1005
NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
......3
BA81-07945B SMT9
1
LEAD-1005
NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
......3
BA99-07565A SMT SUB MATERIAL
1
ASSY SUB/MATERIAL-
NP_SMT
N/P,SMT SUB/MATERIAL,RIBBON,SOLVENT,BOND,-
........4 0201-000160 PART ADHESIVE
0.001 ADHESIVE-TS
D520,NTR
........4 0201-001002 ABLE BOND
0.001 ADHESIVE-TS
8380,SIL,9000CPS,10cc
........4 0202-001499 0.6 SMT
1
SOLDER-WIRE FLUX
SR34 SUPER LFM-48,-,D0.6,96.5Sn/3Ag/0.5Cu,Flux_3.5%
........4 0202-001520 SOLDER CREAM
6
SOLDER-CREAM
LFM-48X TM-HP,D25-45um,96.5Sn/3Ag/0.5Cu,Flux 12.0%
........4 0202-001704 SOLDER CREAM
6
SOLDER-CREAM
NP303-CQS-2-F1,D22-32um,96.5Sn/3Ag/0.5Cu,Flux 11.5%
........4 0204-000199 METAL MASK SOLVENT
0.001 SOLVENT
SUPANUKE-20,I.P.A,98%
....2
BA92-06119D SMT_D
1
ASSY MOTHER BD-
SMT_D
BREMEN-UL,PGA,DDR2,-,NT,-,SMT_D,PV/CONFIG1
......3
0401-000191 D1
1
DIODE-SWITCHING
MMBD4148,100V,200mA,SOT-23,TP
......3
0401-000191 D13
1
DIODE-SWITCHING
MMBD4148,100V,200mA,SOT-23,TP
......3
0404-001084 D14
1
DIODE-SCHOTTKY
BAT54A,30V,200mA,SOT-23,TP
......3
0404-001084 D5
1
DIODE-SCHOTTKY
BAT54A,30V,200mA,SOT-23,TP
......3
0404-001084 D7
1
DIODE-SCHOTTKY
BAT54A,30V,200mA,SOT-23,TP
......3
0404-001382 D6
1
DIODE-SCHOTTKY
CRS06,20V,1000mA,3-2A1A,TP
......3
0501-000465 Q9
1
TR-SMALL SIGNAL
MMBT3904,NPN,350mW,SOT-23,TP,30-300
......3
0505-001007 Q20
1
FET-SILICON
AO4822AL,N,30V,8.5A,0.016ohm,1.1W,SOIC-8
......3
0505-001007 Q25
1
FET-SILICON
AO4822AL,N,30V,8.5A,0.016ohm,1.1W,SOIC-8
......3
0505-001007 Q7
1
FET-SILICON
AO4822AL,N,30V,8.5A,0.016ohm,1.1W,SOIC-8
......3
0505-001064 Q22
1
FET-SILICON
BSS138,N,50V,0.22A,3.5ohm,0.36W,SOT-23
......3
0505-001123 Q3
1
FET-SILICON
SIR474DP,N,30V,20A,0.0075/0.0095ohm,29.8W,PowerPAK SO-8
......3
0505-001123 Q4
1
FET-SILICON
SIR474DP,N,30V,20A,0.0075/0.0095ohm,29.8W,PowerPAK SO-8
......3
0505-001844 Q27
1
FET-SILICON
SI4435DDY-T1-GE3,P,-30V,-11.4A,0.024ohm,5W,SO-8
......3
0505-001883 Q10
1
FET-SILICON
RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323
......3
0505-001883 Q12
1
FET-SILICON
RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323
......3
0505-001883 Q15
1
FET-SILICON
RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323
......3
0505-001883 Q16
1
FET-SILICON
RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323
......3
0505-001883 Q17
1
FET-SILICON
RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323
......3
0505-001883 Q23
1
FET-SILICON
RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323
......3
0505-001883 Q26
1
FET-SILICON
RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323
......3
0505-001883 Q29
1
FET-SILICON
RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323
......3
0505-001883 Q5
1
FET-SILICON
RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323
Summary of Contents for R530
Page 5: ...iii Contents This Document can not be used without Samsung s authorization R530 R730...
Page 64: ...6 40 6 Material List This Document can not be used without Samsung s authorization R530 R730...
Page 240: ...4 23 4 Troubleshooting This Document can not be used without Samsung s authorization R530 R730...
Page 241: ...4 24 4 Troubleshooting This Document can not be used without Samsung s authorization R530 R730...
Page 249: ...4 32 4 Troubleshooting This Document can not be used without Samsung s authorization R530 R730...