8-30
R530/R730
8. Block Diagram and Schematic
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Samsung
Confidential
Samsung
Confidential
Samsung
Confidential
Interrupt I/F
PCI - Expres
s
SP
I
2/
5
PCI
HIGH
RE
V
SAMSUN
G
PCI
Boot BIOS Select
B
ELECTRONICS
PROPRIETARY INFORMATION THAT IS
A
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHER
S
PART NO
.
3
D
4
1
PCI3_GNT0#
HIGH
2
1
C
3
HIGH
TITLE
Resistor for Test : Place Stuffing Option to minimize stubs
MODULE CODE
HJ.KIM
YM.AHN
Jun PARK
SPI3_CS1#
LPC
A
LPC option ; These are used with LP
C
iTPM Disabl
e
SAMSUNG ELECTRONICS CO’S PROPERTY.
D
HIGH
EXCEPT AS AUTHORIZED BY SAMSUNG
.
DEV. STEP
AC caps : PCIE need to be within 250mils of the driver
4
LOW
LOW
PAGE
DAT
E
For EMC
THIS DOCUMENT CONTAINS CONFIDENTIA
L
2
B
BIOS
SAMSUNG PROPRIETAR
Y
SPI
APPROVAL
LAST EDIT
CHECK
DRA
W
C
OF
44-B
4
D:/users/mobile24/mentor/Bremen-L/PV/Bremen-L_MAI
N
ICH9-M (2/5)
ICH_9M_B
Bremen-
L
59
30
BA41-xxxxxA
October 27, 2009 14:27:43 PM
1.0
PV
9/23/2008
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R
81
5
10
K
42-B3
R223
10
K
R
81
2
10
K
10
K
R224
R823
10
K
42-C2,44-B
3
34-A4,40-D
4
13-B1,19-D
4
42-C3
42-B3
R818
10K
31-C3,44-B4
10
K
R
85
0
P3.3V
1%
R787
100K
R220
10
K
R753
1%
nostuff
1% 1K
1K
12.1
R762
1%
R
82
4
42-C3
D2
3
SPI_CS0#
D2
4
SPI_CS1#_GPIO58_CLGPIO
6
F23
SPI_MISO
E23
SPI_MOSI
D2
5
STOP#
A4
TR
D
Y#
F5
31-C3,44-B4
44-B
4
PIRQG#_GPIO
4
F2
G2
PIRQH#_GPIO
5
PLOCK#
C2
PLTRST
#
C14
PME#
R2
REQ0
#
F1
REQ1#_GPI050
B6
REQ2#_GPIO52
F1
3
REQ3#_GPIO54
E6
SERR#
J4
SPI_CL
K
M2
6
PETP
2
PETP
3
K26
H2
6
PETP
4
PETP
5
F26
PETP6_GLAN_TX
P
D2
6
PIRQA#
J5
PIRQB#
E1
PIRQC#
J6
PIRQD#
C4
PIRQE#_GPIO2
H4
PIRQF#_GPIO3
K6
PERP
4
PERP
5
E2
8
PERP6_GLAN_RXP
C2
8
PERR#
E4
PETN
1
P27
M2
7
PETN
2
K2
7
PETN
3
H2
7
PETN
4
PETN
5
F27
PETN6_GLAN_TX
N
D2
7
P2
6
PETP
1
PCIRST
#
R1
N2
9
PERN
1
L29
PERN
2
J29
PERN
3
G2
9
PERN
4
PERN
5
E29
PERN6_GLAN_RXN
C2
9
N2
8
PERP
1
L28
PERP
2
J2
8
PERP
3
G2
8
D6
A5
C_BE3
#
DEVSEL
#
C6
FRAME#
D7
GNT0
#
G4
GNT1#_GPIO51
A7
GNT2#_GPIO53
F1
2
GNT3#_GPIO55
F6
IRDY
#
D3
E3
PAR
PCICLK
D4
AD3
G1
A
D
30
H3
A
D
31
E9
AD4
C9
AD5
AD6
E1
0
B7
AD7
C7
AD8
C5
#0
E
B_
C
9
D
A
D8
C_BE1
#
B4
C_BE2
#
F7
AD2
0
C3
AD2
1
F3
AD2
2
AD2
3
F4
C1
AD2
4
AD2
5
G7
H7
AD2
6
D1
A
D
27
G5
A
D
28
H6
A
D
29
E1
2
G11
AD1
0
AD1
1
F8
F1
1
AD1
2
E7
AD1
3
A3
AD1
4
D2
AD1
5
F1
0
AD1
6
D5
AD1
7
D10
AD1
8
B3
AD1
9
AD2
D9
NH82801IBM
U14-
2
0904-002378
AD0
D11
C8
AD1
R849
10K
P3.3V
R
82
1
10
K
100nF
10V
C905
1%
10K
R222
R
21
9
10
K
12.1
R747
40-C4
10V
100nF
C909
R221
10
K
R215
10
K
R760
12.1
P3.3V
P3.3V
1%
R848
10K
10V
C911
100nF
40-C4
44-B
4
44-B
4
10V
11-B4
P3.3V
nostuff
100nF
C906
0.1n
F
C104
5
50
V
10K
R758
PCI3_EDVSEL#_MN
PCI3_PCLK#_M
N
PCI3_FRAME#_M
N
PCI3_STOP#_MN
SPI3_CLK_R_M
N
SPI3_MOSI_R_M
N
PLT3_RST#
40-C4
40-C4
CHP3_PIRGB#_M
N
CHP3_PIRGD#_MN
CHP3_PIRGA#_M
N
CHP3_PIRGC#_MN
PEX1_MINITXP1_C_M
N
PEX1_MINITXN1_C_M
N
PEX1_GLAN_TXP4_C_MN PEX1_GLAN_TXN4__C_M
N
PCI3_REQ0#_MN
PCI3_GNT0#_MN
PCI3_IRDY#_MN
CHP3_SERIR
Q
PCI3_CLKRUN
#
PEX1_MINITXP1 PEX1_MINITXN1 PEX1_MINIRXP1 PEX1_MINIRXN1
CLK3_PCLKICH
PCI3_PERR#_M
N
HST3_SPI3_D
O
PEX1_LAN_TXP4 PEX1_LAN_TXN4 PEX1_LAN_RXP4 PEX1_LAN_RXN4
PCI3_SERR#_M
N
PCI3_TRDY#_M
N
HST3_SPI3_D
I
SPI3_CS0#_R_MN
HST3_SPI3_CS# HST3_SPI3_CLK
Summary of Contents for R530
Page 5: ...iii Contents This Document can not be used without Samsung s authorization R530 R730...
Page 64: ...6 40 6 Material List This Document can not be used without Samsung s authorization R530 R730...
Page 240: ...4 23 4 Troubleshooting This Document can not be used without Samsung s authorization R530 R730...
Page 241: ...4 24 4 Troubleshooting This Document can not be used without Samsung s authorization R530 R730...
Page 249: ...4 32 4 Troubleshooting This Document can not be used without Samsung s authorization R530 R730...