Samsung R530, Service Manual

Page: 175 / 255

8-64
R530/R730
8. Block Diagram and Schematic
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- This Document can not be used without Samsung's authorization -
Samsung
Confidential
Samsung
Confidential
Samsung
Confidential
D
TITLE
For Intel 45nm(From penryn)
CHECK APPROVAL
SAMSUN
G
0101 111xb
MODULE CODE
1
SMBUS Address 7Ah
DEV. STEP
B C
1
ELECTRONICS
TRIP_SET 1500 : 95 degree
4 4
PROPRIETARY INFORMATION THAT IS
1
0101 110xb
2
0
0111 101xb (7A)
Opposite side of CPU.
D
OF
SAMSUNG PROPRIETAR
Y
C
HIGH
Z
0
RE
V
SAMSUNG ELECTRONICS CO’S PROPERTY.
Line Width = 20 mi
l
DESIGN
1
To support heatsink
3
THERMAL SENSOR & FAN CONTROL
SHDN_SEL MODE
A
2
THIS DOCUMENT CONTAINS CONFIDENTIA
L
PAGE
3
DAT
E
10mil width and 10mil spacing.
A
INTEL TR MODE
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
AMD CPU/DIODE MODE
B
LAST EDIT
PART NO
.
EXCEPT AS AUTHORIZED BY SAMSUNG
.
ADDRESSS_SEL MODE
October 05, 2009 20:00:56 PM
BA41-xxxxxA
8
50
Bremen-UL
THERMAL SENSOR
THERMAL SENSOR EMC2112
D:/users/mobile29/mentor/Bremen-UL/Bremen-UL_Et
c
TW.Kim
HJ.Kim
SJ.Par
k
9/23/2008
ADV2nd
1.0
EXT.DIODE 2 MODE
HIGH
Z
C845
1000nF-X5
R
6.3V
LENGTH HEAD DIA
BA61-01090
A
M500
R4
7
49.9
1%
P3.3V
P3.3V_AUX
1%
R562
1.5K
10000nF-X5
R
C79
6.3V
1%
P3.3V_AUX
10K
R54
1%
R53
10K
0
nostuf
f
R561
P3.3V_AUX
P5.0V
10000nF-X5R
C566
6.3V
10V 100nF
C5
9
P3.3V
R559
1% 10
K
M501
BA61-01090A
DIA HEAD LENGTH
Q9
1
3 2
50
V
C
56
4
MMBT3904
HDR-4P-1R-SM
D
J2
3711-00045
6
1 2 3 4 MNT
1
5 6
MNT
2
2.2n
F
21
7
TRIP_SE
T
1
VDD_3
V
16
VDD_5V_
1
19
VDD_5V_
2
DP
1
DP3_DN
2
4
17
FAN_
1
18
FAN_
2
GN
D
13
9
RESET#
6
SHDN_SEL
15
SMCL
K
SMDATA
14 8
SYS_SHDN#
20
TACH
THERMAL_PAD
U502 EMC2112-BP-TR
1209-001887
ADDR_SE
L
10
12
ALERT
#
CL
K
11 2
DN
1
DN3_DP
2
5 3
C5
8
100nF 10V
C
56
5
2.2n
F
50
V
nostuff
1%
R560 10K
10K R574
1%
10K R48
1%
THM3_VDD_3V_MN
FAN3_FDBACK
#
THM3_STP#
KBC3_THERM_SMDATA KBC3_THERM_SMCLK
CPU2_THERMDA CPU2_THERMD
C
THM3_ALERT#
FAN5_VDD
FAN3_FDBACK#
FAN5_VDD
THM3_TRIP_SET_MN
THM3_THERMDN_M
N
THM3_THERMDP_M
N
THM3_SHDN_SEL_M
N