Samsung OFFICESERV 7100, Service Manual

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OfficeServ 7100 Service Manual
© SAMSUNG Electronics Co., Ltd.
XI
3.4.1 4SWM Module........................................................................................................................ 3-18
3.4.2 UNI Board ............................................................................................................................... 3-20
3.4.3 4TRM Module ......................................................................................................................... 3-23
3.4.4 4SLM Module ......................................................................................................................... 3-25
3.4.5 8TRK Board ............................................................................................................................ 3-26
3.4.6 TEPRI2 Board ........................................................................................................................ 3-30
3.4.7 8COMBO Board ..................................................................................................................... 3-37
3.4.8 16SLI2/16MWSLI Board ........................................................................................................ 3-42
3.4.9 MGI64/MGI16 Board ............................................................................................................. 3-46
3.4.10 PLIM Board ............................................................................................................................. 3-50
3.5 Option Board (Daughter Board) ............................................................................................ 3-52
3.5.1 MIS Board ............................................................................................................................... 3-52
3.5.2 MFM Board ............................................................................................................................. 3-56
3.5.3 RCM Board ............................................................................................................................. 3-59
CHAPTER 4. Programming for Maintenance 4-1
4.1 Smart Media Programming ...................................................................................................... 4-1
4.1.1 Installation ................................................................................................................................. 4-1
4.1.2 Performing Functions ............................................................................................................... 4-3
4.2 CPLD Programming .................................................................................................................. 4-8
4.2.1 Lattice CPLD Programming .................................................................................................... 4-8
4.2.2 Altera EPLD Programming .................................................................................................... 4-17
4.3 Offline Programming .............................................................................................................. 4-20
4.3.1 Preparation ............................................................................................................................. 4-20
4.3.2 Environment Configuration .................................................................................................... 4-20
4.3.3 Entering the Offline Test Mode .............................................................................................. 4-21
CHAPTER 5. Parts Layout 5-1
5.1 MP10/11 Board .......................................................................................................................... 5-2
5.2 4SWM ......................................................................................................................................... 5-4
5.3 4DLM .......................................................................................................................................... 5-5
5.4 4TRM .......................................................................................................................................... 5-6
5.5 4SLM ........................................................................................................................................... 5-7
5.6 2BRM .......................................................................................................................................... 5-8
5.7 TEPRI2 Board ............................................................................................................................ 5-9
5.8 8COMBO .................................................................................................................................. 5-11
5.9 16DLI2 ...................................................................................................................................... 5-13