Galaxy Raid GHDX4 SAS<>-SAS / SATA 12Bay
Installation / Hardware Reference Manual
x
5.6.2
Replacing a Cooling Module............................................................................ 5-14
5.7.
R
EPLACING A
H
ARD
D
RIVE
........................................................................................ 5-15
5.7.1
Hard Drive Maintenance Overview .................................................................. 5-15
5.7.2
Replacing a Hard Drive ................................................................................... 5-16
APPENDIX A SPECIFICATIONS
A.1
T
ECHNICAL
S
PECIFICATIONS
....................................................................................... A-1
A.2
C
ONTROLLER
S
PECIFICATIONS
.................................................................................... A-3
A.3
P
OWER
S
UPPLY
S
PECIFICATIONS
................................................................................ A-4
A.4
RAID
M
ANAGEMENT
.................................................................................................. A-5
A.5
F
AULT
T
OLERANCE
M
ANAGEMENT
............................................................................... A-5
APPENDIX B PINOUTS
B.1
SAS
C
ONNECTOR
P
INOUTS
....................................................................................... B-1
B.2
COM1
S
ERIAL
P
ORT
C
ABLE
...................................................................................... B-2
B.3
E
THERNET
P
ORT
P
INOUTS
........................................................................................ B-3
B.4
P
OWER
C
ONNECTORS
............................................................................................... B-3
Safety Precautions
Precautions and Instructions
•
Prior to powering on the subsystem, ensure that the correct power range
is being used.
•
If it is necessary to transport the subsystem, repackage all disk drives
separately in the drive trays and in the original package foam blocks. If
using the original package material, other replaceable modules can stay
within the enclosure.
•
The Galaxy subsystems come with 12, 16, or 24 drive bays. Leaving any
of these drive bays empty will greatly affect the efficiency of the airflow
within the enclosure, and will consequently lead to the system
overheating, which can cause irreparable damage.
•
If a module fails, leave it in place until you have a replacement unit and
you are ready to replace it.
•
Airflow Consideration: The subsystem requires an airflow clearance,
especially at the front and rear. A clearance of at least 18 to 20
centimeters is required at the rear side and any objects blocking the
exhaust airflow, e.g., cables dangling at the fan outlet, should be avoided.
•
Handle subsystem modules using the retention screws, eject levers, and
the metal frames/face plates. Avoid touching PCB boards and connector
pins.
