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MELSEC-Q
4 SETUP AND PROCEDURES BEFORE OPERATION
4 SETUP AND PROCEDURES BEFORE OPERATION
4.1 Handling Precautions
(1) Do not drop the module or subject it to heavy impact.
(2) Do not remove the PCB of the module from its case. Doing so may cause the
module to fail.
(3) Be careful not to let foreign particles such as swarf or wire chips enter the module.
They may cause a fire, mechanical failure or malfunction.
(4) The top surface of the module is covered with a protective film to prevent foreign
objects such as wire burrs from entering the module during wiring. Do not remove
this film until the wiring is complete. Before operating the system, be sure to
remove the film to provide adequate ventilation.
(5) Tighten the screws such as module fixing screws within the following ranges.
Loose screws may cause short circuits, failures, or malfunctions.
Screw location
Tightening torque range
Module fixing screw (M3 screw)
1
0.36 to 0.48 N.m
Terminal block screw (M3 screw)
0.42 to 0.58 N.m
Terminal block mounting screw (M3.5 screw)
0.66 to 0.89 N.m
1:
The module can be easily fixed onto the base unit using the hook at the top of the
module.
However, it is recommended to secure the module with the module fixing screw if
the module is subject to significant vibration.
(6) To mount the module on the base unit, fully insert the module fixing latch into the
fixing hole in the base unit and press the module using the hole as a fulcrum.
Improper installation may result in a module malfunction, or may cause the
module to fall off.
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Summary of Contents for q64rd
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Page 62: ...3 39 3 39 MELSEC Q 3 SPECIFICATIONS MEMO ...
Page 92: ...5 17 5 17 MELSEC Q 5 UTILITY PACKAGE GX Configurator TI X Y Monitor Test 1 OMC refresh ...
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