Intel® Server System S9200WK Product Family Setup and Service Guide
53
Memory Heat Spreader Thermal Pad Replacement (Liquid Cooled Compute
Modules only)
In liquid cooled compute module configurations, the heat generated from installed DIMMs is drawn out of
the compute module by means of an array of memory heat spreaders that are interconnected to the internal
plumbing of the liquid cooling loop. Each heat spreader is positioned in between two DIMMs. Thermal pads
are affixed to both sides of a heat spreader to ensure efficient heat dissipation from the DIMMs to the heat
spreader.
Should a thermal pad become damaged while installing or removing a DIMM, or become damaged or worn
for other reasons, the following sections provide the instructions necessary to remove and replace a heat
spreader thermal pad.
Note
: To maintain optimal performance of the liquid cooling loop, Intel recommends replacing ALL thermal
pads at once.
4.11.1
Thermal Pad Removal
1.
Remove the select compute module from the server chassis (see Section 4.2.1).
2.
Remove all DIMMs from the compute module (see Section 4.10.2.1).
Figure 57. Removing a thermal pad
3.
Carefully peel away the thermal pads from both sides of all heat spreaders.
4.
Using isopropyl alcohol and a lint free cloth, carefully clean the surface of each heat spreader,
ensuring that no thermal pad residue remains.
