Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual Download

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Thermal and Mechanical Design Guidelines

Contents

Introduction ...................................................................................................... 9

1.1

Document Goals and Scope ...................................................................... 9

1.1.1

Importance of Thermal Management ............................................ 9

1.1.2

Document Goals ........................................................................ 9

1.1.3

Document Scope ...................................................................... 10

1.2

References ............................................................................................ 11

1.3

Definition of Terms................................................................................. 11

Processor Thermal/Mechanical Information .......................................................... 13

2.1

Mechanical Requirements ........................................................................ 13

2.1.1

Processor Package .................................................................... 13

2.1.2

Heatsink Attach ........................................................................ 15

2.1.2.1

General Guidelines ..................................................... 15

2.1.2.2

Heatsink Clip Load Requirement .................................. 15

2.1.2.3

Additional Guidelines .................................................. 16

2.2

Thermal Requirements ........................................................................... 16

2.2.1

Processor Case Temperature ...................................................... 16

2.2.2

Thermal Profile ......................................................................... 17

2.2.3

Thermal Solution Design Requirements ....................................... 17

2.2.4

CONTROL

................................................................................... 18

2.3

Heatsink Design Considerations ............................................................... 19

2.3.1

Heatsink Size ........................................................................... 20

2.3.2

Heatsink Mass .......................................................................... 20

2.3.3

Package IHS Flatness ................................................................ 21

2.3.4

Thermal Interface Material ......................................................... 21

2.4

System Thermal Solution Considerations .................................................. 22

2.4.1

Chassis Thermal Design Capabilities ............................................ 22

2.4.2

Improving Chassis Thermal Performance ..................................... 22

2.4.3

Summary ................................................................................ 23

2.5

System Integration Considerations ........................................................... 23

Thermal Metrology ............................................................................................ 25

3.1

Characterizing Cooling Performance Requirements ..................................... 25

3.1.1

Example .................................................................................. 26

3.2

Processor Thermal Solution Performance Assessment ................................. 27

3.3

Local Ambient Temperature Measurement Guidelines ................................. 27

3.4

Processor Case Temperature Measurement Guidelines ................................ 30

Thermal Management Logic and Thermal Monitor Feature ...................................... 31

4.1

Processor Power Dissipation .................................................................... 31

4.2

Thermal Monitor Implementation ............................................................. 31

4.2.1

PROCHOT# Signal .................................................................... 32

4.2.2

Thermal Control Circuit ............................................................. 32

4.2.2.1

Thermal Monitor ........................................................ 32

4.2.3

Thermal Monitor 2 .................................................................... 33

4.2.4

Operation and Configuration ...................................................... 34

4.2.5

On-Demand Mode ..................................................................... 35

Summary of Contents for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN

Page 1: ...er 318734 016 Intel Core 2 Duo Processor E8000 and E7000 Series Intel Pentium Dual Core Processor E6000 and E5000 Series and Intel Celeron Processor E3000 Series Thermal and Mechanical Design Guidelines August 2010 ...

Page 2: ...dor remains solely responsible for the design sale and functionality of its product including any liability arising from product infringement or product warranty Intel provides this information for customer s convenience only Use at your own risk Intel accepts no liability for results if customer chooses at its discretion to implement these methods within its business operations Intel makes no rep...

Page 3: ...atsink Size 20 2 3 2 Heatsink Mass 20 2 3 3 Package IHS Flatness 21 2 3 4 Thermal Interface Material 21 2 4 System Thermal Solution Considerations 22 2 4 1 Chassis Thermal Design Capabilities 22 2 4 2 Improving Chassis Thermal Performance 22 2 4 3 Summary 23 2 5 System Integration Considerations 23 3 Thermal Metrology 25 3 1 Characterizing Cooling Performance Requirements 25 3 1 1 Example 26 3 2 P...

Page 4: ...tric Envelope for Intel Reference BTX Thermal Module Assembly 47 5 6 Preload and TMA Stiffness 48 5 6 1 Structural Design Strategy 48 5 6 2 TMA Preload verse Stiffness 48 6 ATX Thermal Mechanical Design Information 51 6 1 ATX Reference Design Requirements 51 6 2 Validation Results for Reference Design 53 6 2 1 Heatsink Performance 53 6 2 2 Acoustics 54 6 2 3 Altitude 54 6 2 4 Heatsink Thermal Vali...

Page 5: ...al Test Equipment 78 B 3 Test Procedure Examples 78 B 3 1 Time Zero Room Temperature Preload Measurement 79 B 3 2 Preload Degradation under Bake Conditions 79 Appendix C Thermal Interface Management 81 C 1 Bond Line Management 81 C 2 Interface Material Area 81 C 3 Interface Material Performance 81 Appendix D Case Temperature Reference Metrology 83 D 1 Objective and Scope 83 D 2 Supporting Test Equ...

Page 6: ...ference Clip 62 Figure 6 8 Critical Core Dimension 62 Figure 7 1 Intel QST Overview 64 Figure 7 2 PID Controller Fundamentals 65 Figure 7 3 Intel QST Platform Requirements 66 Figure 7 4 Example Acoustic Fan Speed Control Implementation 67 Figure 7 5 Digital Thermal Sensor and Thermistor 68 Figure 7 6 Board Deflection Definition 71 Figure 7 7 Example Defining Heatsink Preload Meeting Board Deflecti...

Page 7: ...lumetric Sheet 2 114 Figure 7 45 BTX Thermal Module Keep Out Volumetric Sheet 3 115 Figure 7 46 BTX Thermal Module Keep Out Volumetric Sheet 4 116 Figure 7 47 BTX Thermal Module Keep Out Volumetric Sheet 5 117 Figure 7 48 ATX Reference Clip Sheet 1 118 Figure 7 49 ATX Reference Clip Sheet 2 119 Figure 7 50 Reference Fastener Sheet 1 120 Figure 7 51 Reference Fastener Sheet 2 121 Figure 7 52 Refere...

Page 8: ...0 January 2009 008 Added Intel Pentium dual core processor E6300 May 2009 009 Added Intel Core 2 Duo processor E7600 June 2009 010 Added Intel Pentium dual core processor E6500 August 2009 011 Intel Celeron processor E3x00 series August 2009 012 Added Intel Pentium dual core processor E6600 Intel Celeron processor E3400 January 2010 013 Added Intel Pentium dual core processor E5500 April 2010 014 ...

Page 9: ...mal solution All of these parameters are affected by the continued push of technology to increase processor performance levels and packaging density more transistors As operating frequencies increase and packaging size decreases the power density increases while the thermal solution space and airflow typically become more constrained or remains the same within the system The result is an increased...

Page 10: ...y the specific reference design will be listed In this document when a reference is made to the datasheet the reader should refer to the Intel Core 2 Duo Processor E8000 and E7000 Series Datasheet Intel Pentium Dual Core Processor E6000 and E5000 Series Datasheet and Intel Celeron Processor E3000 Series Datasheet If needed for clarity the specific processor datasheet will be referenced Chapter 2 o...

Page 11: ...http www formfactors org microATX Thermal Design Suggestions http www formfactors org Balanced Technology Extended BTX System Design Guide http www formfactors org Thermally Advantaged Chassis Design Guide http www intel com go chassis 1 3 Definition of Terms Term Description TA The measured ambient temperature locally surrounding the processor The ambient temperature should be measured just upstr...

Page 12: ...ge ACPI Advanced Configuration and Power Interface Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct For this example it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface Thermal Monitor A feature on the processor that attempts to keep the processor die temperature within factory specifications TCC Therm...

Page 13: ...hrough a land grid array LGA surface mount socket The socket contains 775 contacts arrayed about a cavity in the center of the socket with solder balls for surface mounting to the motherboard The socket is named LGA775 socket A description of the socket can be found in the LGA775 Socket Mechanical Design Guide The package includes an integrated heat spreader IHS that is shown in Figure 2 1 for ill...

Page 14: ...ion removal mechanical stress testing and standard shipping conditions When a compressive static load is necessary to ensure thermal performance of the thermal interface material between the heatsink base and the IHS it should not exceed the corresponding specification given in the processor datasheet When a compressive static load is necessary to ensure mechanical performance it should remain in ...

Page 15: ...g LGA775 socket solder joints One of the strategies for mechanical protection of the socket is to use a preload and high stiffness clip This strategy is implemented by the reference design and described in Section 6 7 Note Package pull out during mechanical shock and vibration is constrained by the LGA775 socket load plate refer to the LGA775 Socket Mechanical Design Guide for further information ...

Page 16: ...atsink is assumed to be installed after the motherboard has been installed into the chassis Minimizes contact with the motherboard surface during installation and actuation to avoid scratching the motherboard 2 2 Thermal Requirements Refer to the datasheet for the processor thermal specifications The majority of processor power is dissipated through the IHS There are no additional components such ...

Page 17: ...l to the system For ATX platforms an active air cooled design assumed be used in ATX Chassis with a fan installed at the top of the heatsink equivalent to the reference design see Chapter 6 should be designed to manage the processor TDP at an inlet temperature of 35 C 5 C 40 C For BTX platforms a front to back cooling design equivalent to Intel BTX TMA Type II reference design see the Chapter 5 sh...

Page 18: ...sensor when the thermal solution fan speed is being controlled by the digital thermal sensor The TCONTROL parameter defines a very specific processor operating region where fan speed can be reduced This allows the system integrator a method to reduce the acoustic noise of the processor cooling solution while maintaining compliance to the processor thermal specification Note The TCONTROL value for ...

Page 19: ...the conduction path from the heat source to the fins directly impact the thermal performance of the heatsink In particular the quality of the contact between the package IHS and the heatsink base has a higher impact on the overall thermal solution performance as processor cooling requirements become stricter Thermal interface material TIM is used to fill in the gap between the IHS and the bottom s...

Page 20: ...raints defined in the ATX Specification V2 1 and the microATX Motherboard Interface Specification V1 1 found at http www formfactors org The resulting space available above the motherboard is generally not entirely available for the heatsink The target height of the heatsink must take into account airflow considerations for fan performance for example as well as other design considerations air duc...

Page 21: ...ed in the datasheet and can be used as a baseline to predict heatsink performance during the design phase Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to capture any impact of IHS flatness change due to combined socket and heatsink loading While socket loading alone may increase the IHS warpage the heatsink preload redistributes the load on...

Page 22: ...solutions for ATX assume the use of the thermally advantaged chassis refer to Thermally Advantaged Chassis TAC Design Guide for TAC thermal and mechanical requirements The TAC 2 0 Design Guide defines a new processor cooling solution inlet temperature target of 40 C The existing TAC 1 1 chassis can be compatible with TAC 2 0 guidelines 2 4 2 Improving Chassis Thermal Performance The heat generated...

Page 23: ...tions in heatsink design include The local ambient temperature TA at the heatsink which is a function of chassis design The thermal design power TDP of the processor and the corresponding maximum TC as calculated from the thermal profile These parameters are usually combined in a single lump cooling performance parameter ΨCA case to air thermal characterization parameter More information on the de...

Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines ...

Page 25: ...ingle resistance parameter like Ψ The case to local ambient thermal characterization parameter value ΨCA is used as a measure of the thermal performance of the overall thermal solution that is attached to the processor package It is defined by the following equation and measured in units of C W ΨCA TC TA PD Equation 1 Where ΨCA Case to local ambient thermal characterization parameter C W TC Proces...

Page 26: ...Socket Processor IHS System Board TC Heatsink 3 1 1 Example The cooling performance ΨCA is defined using the principle of thermal characterization parameter described above The case temperature TC MAX and thermal design power TDP given in the processor datasheet Define a target local ambient temperature at the processor TA Since the processor thermal profile applies to all processor frequencies it...

Page 27: ...acturing process The TTV provides consistent power and power density for thermal solution characterization and results can be easily translated to real processor performance Accurate measurement of the power dissipated by an actual processor is beyond the scope of this document Once the thermal solution is designed and validated with the TTV it is strongly recommended to verify functionality of th...

Page 28: ...et heatsink If a barrier is used the thermocouple can be taped directly to the barrier with a clear tape at the horizontal location as previously described half way between the fan hub and the fan housing If a variable speed fan is used it may be useful to add a thermocouple taped to the barrier above the location of the temperature sensor used by the fan to check its speed setting against air tem...

Page 29: ...nical Design Guidelines 29 Figure 3 2 Locations for Measuring Local Ambient Temperature Active ATX Heatsink Note Drawing Not to Scale Figure 3 3 Locations for Measuring Local Ambient Temperature Passive Heatsink Note Drawing Not to Scale ...

Page 30: ... and the complete measurement system must be routinely checked against known standards When measuring the temperature of a surface that is at a different temperature from the surrounding local ambient air errors could be introduced in the measurements The measurement errors could be caused by poor thermal contact between the junction of the thermocouple and the surface of the integrated heat sprea...

Page 31: ...ie thermal management feature called Thermal Monitor is available on the processor It provides a thermal management approach to support the continued increases in processor frequency and performance By using a highly accurate on die temperature sensing circuit and a fast acting Thermal Control Circuit TCC the processor can rapidly initiate thermal management control The Thermal Monitor can reduce ...

Page 32: ...al designs to target maximum sustained current instead of maximum current Systems should still provide proper cooling for the VR and rely on bi directional PROCHOT signal only as a backup in case of system cooling failure Note A thermal solution designed to meet the thermal profile specifications should rarely experience activation of the TCC as indicated by the PROCHOT signal going active 4 2 2 T...

Page 33: ... represents the normal operating condition for the processor The second operating point consists of both a lower operating frequency and voltage When the TCC is activated the processor automatically transitions to the new frequency This transition occurs very rapidly on the order of 5 microseconds During the frequency transition the processor is unable to service any bus requests all bus traffic i...

Page 34: ...nitor the processor thermal status The Thermal Control Circuit is enabled by the BIOS setting a bit in an MSR model specific register Enabling the Thermal Control Circuit allows the processor to attempt to maintain a safe operating temperature without the need for special software drivers or interrupt handling routines When the Thermal Control Circuit has been enabled processor power consumption w...

Page 35: ...d to approximately 1 µs on time 1 µs total cycle time 3 1 µs duty cycle Similarly for a duty cycle of 7 8 87 5 the clock on time would be extended to 21 µs 21 21 3 7 8 duty cycle In a high temperature situation if the thermal control circuit and ACPI MSRs automatic and on demand modes are used simultaneously the fixed duty cycle determined by automatic mode would take precedence Note On demand mod...

Page 36: ...ssor bus snooping ACPI timer and interrupts are active at all times 4 2 8 THERMTRIP Signal In the event of a catastrophic cooling failure the processor will automatically shut down when the silicon temperature has exceeded the TCC activation temperature by approximately 20 to 25 C At this point the system bus signal THERMTRIP goes active and power must be removed from the processor THERMTRIP activ...

Page 37: ...for fan speed control FSC The DTS is monitoring the same sensor that activates the TCC see Section 4 2 2 Readings from the DTS are relative to the activation of the TCC The DTS value where TCC activation occurs is 0 zero A TCONTROL value will be provided for use with DTS The usage model for TCONTROL with the DTS as below If the Digital thermal sensor reading is less than TCONTROL the fan speed can...

Page 38: ... Set Overview For additional information on the PECI see the datasheet The PECI bus is available on pin G5 of the LGA 775 socket Intel chipsets beginning with the ICH8 have included PECI host controller The PECI interface and the Manageability Engine are key elements to the Intel Quiet System Technology Intel QST see Chapter 7 and the Intel Quiet System Technology Configuration and Tuning Manual I...

Page 39: ...ent temperature to the chassis of across the fan inlet resulting in a temperature rise TR of 0 5 C Meeting TA and ΨCA targets can maximize processor performance refer to Sections 2 2 2 4 and Chapter 4 Minimizing TR can lead to improved acoustics Table 5 1 Balanced Technology Extended BTX Type II Reference TMA Performance Processor Thermal Requirements Ψca Mean 3σ TA Assumption Notes Intel Core 2 D...

Page 40: ...e is defined in terms of measured sound power LwA as defined in ISO 9296 standard and measured according to ISO 7779 2 Acoustic testing will be for the TMA only when installed in a BTX S2 chassis for Case 1 and 3 3 Acoustics testing for Case 2 will be system level in the same a BTX S2 reference chassis and commercially available power supply Acoustic data for Case 2 will be provided in the validat...

Page 41: ...or BTX platforms Because of the coupling between TMA thermal performance and system impedance the designer should understand the TMA effective fan curve This effective fan curve represents the performance of the fan component AND the impedance of the stator heatsink duct and flow partitioning devices The BTX system integrator can evaluate a TMA based on the effective fan curve of the assembly and ...

Page 42: ...r airflow to bypass the heatsink and flow over the VR region on both the primary and secondary sides of the board The following requirements apply to VR cooling Table 5 3 VR Airflow Requirements Item Target Minimum VR bypass airflow for 775_VR_CONFIG_06 processors 2 4 CFM NOTES 1 This is the recommended airflow rate that should be delivered to the VR when the VR power is at a maximum in order to s...

Page 43: ...atsink will be validated within the specific boundary conditions based on the methodology described Section 5 2 and using a thermal test vehicle Testing is done in a BTX chassis at ambient lab temperature The test results for a number of samples will be reported in terms of a worst case mean 3σ value for thermal characterization parameter using real processors based on the thermal test vehicle cor...

Page 44: ...or a system Quantity 2 drops for and directions in each of 3 perpendicular axes that is total 12 drops Profile 25 G trapezoidal waveform 225 in sec minimum velocity change systems 20 lbm 250 in sec minimum velocity change systems 20 lbm Setup Mount sample system on tester Figure 5 3 Shock Acceleration Curve Vibration System Level 0 0001 0 001 0 01 0 1 1 10 100 1000 Hz g 2 Hz 3 dB Control Limit 3 d...

Page 45: ...ysical damage to the heatsink attach mechanism including such items as clip and motherboard fasteners 2 Heatsink must remain attached to the motherboard 3 Heatsink remains seated and its bottom remains mated flatly against IHS surface No visible gap between the heatsink base and processor IHS No visible tilt of the heatsink with respect to its attach mechanism 4 No signs of physical damage on moth...

Page 46: ... pass criterion is that the system under test shall successfully complete the checking of BIOS basic processor functions and memory without any errors 5 3 Material and Recycling Requirements Material shall be resistant to fungal growth Examples of non resistant materials include cellulose materials animal and vegetable based adhesives grease oils and many hydrocarbons Synthetic materials such as P...

Page 47: ... access the moving parts of the fan consider adding safety feature so that there is no risk of personal injury 5 5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly Figure 7 43 through Figure 7 47 in Appendix G provides the motherboard keep out information for the BTX thermal mechanical solutions Additional information on BTX design considerations can be found in the Balanced Tech...

Page 48: ...joint The allowable preload range for BTX platforms is provided in Table 5 4 but the specific target value is a function of the Thermal Module effective stiffness The solution space for the Thermal Module effective stiffness and applied preload combinations is shown by the shaded region of Figure 5 6 This solution space shows that the Thermal Module assembly must have an effective stiffness that i...

Page 49: ...ithin this region The design tolerance for the preload and TMA stiffness should also reside within this boundary Note that the lower and upper horizontal boundaries represent the preload limits provided in Table 5 4 The equation for the left hand boundary is described in note 2 2 The equation for this section of the preload Thermal Module stiffness boundary is given by the following relationship M...

Page 50: ... Pointes and Duct to SRM Interface Features NOTES 1 For clarity the motherboard is not shown in this figure In an actual assembly the captive 6x32 screws in the thermal module pass through the rear holes in the motherboard designated in the socket keep in Figure 7 43 through Figure 7 47 in Appendix G and screw into the SRM and chassis PEM features 2 This front duct ramp feature has both outer and ...

Page 51: ...ew of this reference design Note The part number E18764 001 provided in this document is for reference only The revision number 001 may be subject to change without notice The E18764 001 reference design takes advantage of an acoustic improvement to reduce the fan speed to show the acoustic advantage its acoustic results show in the Table 6 2 The E18764 001 reference design takes advantage of the ...

Page 52: ...Section 6 6 remain the same for a thermal solution for the processor in the 775 Land LGA package Note If this fan design is used in your product and you will deliver it to end use customers you have the responsibility to determine an adequate level of protection such as protection barriers a cage or an interlock against contact with the energized fan by the user during user servicing Note Developm...

Page 53: ...at the processor fan heatsink inlet discussed Section 2 4 1 Table 6 1 E18764 001 Reference Heatsink Performance Processor Target Thermal Performance Ψca Mean 3σ TA Assumption Notes Intel Core 2 Duo processor E8000 series with 6 MB cache 0 50 C W 40 C 1 2 Intel Core 2 Duo processor E7000 series with 3 MB cache Intel Pentium dual core processor E6000 E5000 series with 2 MB cache Intel Celeron proces...

Page 54: ...S 1 Acoustic performance is defined in terms of measured sound power LwA as defined in ISO 9296 standard and measured according to ISO 7779 While the fan hub thermistor helps optimize acoustics at high processor workloads by adapting the maximum fan speed to support the processor thermal profile additional acoustic improvements can be achieved at lower processor workload by using the TCONTROL spec...

Page 55: ...tion factors Note The above 81 28 mm obstruction height that is used for testing complies with the recommended obstruction height of 88 9 mm for the ATX form factor However it would conflict with systems in strict compliance with the ATX specification which allows an obstruction as low as 76 2 mm above the motherboard surface in Area A 6 3 Environmental Reliability Testing 6 3 1 Structural Reliabi...

Page 56: ... for and directions in each of 3 perpendicular axes that is total 18 drops Profile 50 G trapezoidal waveform 170 in sec minimum velocity change Setup Mount sample board on test fixture Figure 6 4 Shock Acceleration Curve 0 10 20 30 40 50 60 0 2 4 6 8 10 12 Time milliseconds A c c e l e r a t i o n g 0 001 0 01 0 1 1 10 100 1000 Frequency Hz PSD g 2 Hz 3 13GRMS 10 minutes per axis 5 Hz 500 Hz 5 0 0...

Page 57: ...icant physical damage to the heatsink attach mechanism including such items as clip and motherboard fasteners 2 Heatsink must remain attached to the motherboard 3 Heatsink remains seated and its bottom remains mated flatly against IHS surface No visible gap between the heatsink base and processor IHS No visible tilt of the heatsink with respect to its attach mechanism 4 No signs of physical damage...

Page 58: ... is that the system under test shall successfully complete the checking of BIOS basic processor functions and memory without any errors 6 4 Material and Recycling Requirements Material shall be resistant to fungal growth Examples of non resistant materials include cellulose materials animal and vegetable based adhesives grease oils and many hydrocarbons Synthetic materials such as PVC formulations...

Page 59: ...nical Design Figure 7 40 Figure 7 41 and Figure 7 42 in Appendix G provides detailed reference ATX μATX motherboard keep out information for the reference thermal mechanical enabling design These drawings include height restrictions in the enabling component region The maximum height of the reference solution above the motherboard is 71 12 mm 2 8 inches and is compliant with the motherboard primar...

Page 60: ...n particular upward board deflection Figure 6 5 In addition a moderate preload provides initial downward deflection Figure 6 5 Upward Board Deflection during Shock The target metal clip nominal stiffness is 540 N mm 3100 lb in The combined target for reference clip and fasteners nominal stiffness is 380 N mm 2180 lb in The nominal preload provided by the reference design is 191 3 N 44 5 N 43 lb 10...

Page 61: ...insertion and is meant to be trapped between the core shoulder and the extrusion as shown in Figure 6 6 Figure 6 6 Reference Clip Heatsink Assembly Core shoulder traps clip in place Core shoulder traps clip in place Clip The mechanical interface with the reference attach mechanism is defined in Figure 6 7 and Figure 6 8 Complying with the mechanical interface parameters is critical to generating a...

Page 62: ...p Core 1 6 mm Detail A Fin Array Clip Core 1 6 mm Detail A Fin Array Clip Core 1 6 mm Detail A Fin Array Clip Core 1 6 mm Figure 6 8 Critical Core Dimension R 0 40 mm max R 0 40 mm max Φ36 14 0 10 mm Gap required to avoid core surface blemish during clip assembly Recommend 0 3 mm min 1 00 mm min 2 596 0 10 mm Φ38 68 0 30 mm 1 00 0 10 mm Core NOTE Dimension from the bottom of the clip to the bottom...

Page 63: ...ntel QST in particular rely on a thermal solution being compliant to the processor thermal profile It is unlikely that any fan speed control algorithm can compensate for a non compliant thermal solution See Chapter 5 and Chapter 6 for thermal solution requirements that should be met before evaluating or configuring a system with Intel QST 7 1 Intel QST Algorithm The objective of Intel QST is to mi...

Page 64: ...nse to be determined based upon the difference between current temperature readings and specific temperature targets A major advantage of a PID Algorithm is the ability to control the fans to achieve sensor temperatures much closer to the TCONTROL Figure 7 2 is an illustration of the PID fan control algorithm As illustrated in the figure when the actual temperature is below the target temperature ...

Page 65: ...es are used to control response of algorithm Kp proportional gain Ki Integral gain Kd derivative gain The Intel Quiet System Technology Intel QST Configuration and Tuning Manual provides initial values for the each of the gain constants In addition it provides a methodology to tune these gain values based on system response Finally the fan speed change will be calculated using the following formul...

Page 66: ...d 2 MB reserved for Intel QST FW execution SPI Flash with sufficient space for the Intel QST Firmware SST based thermal sensors to provide board thermal data for Intel QST algorithms Intel QST firmware Figure 7 3 Intel QST Platform Requirements Note Simple Serial Transport SST is a single wire bus that is included in the ICH8 to provide additional thermal and voltage sensing capability to the Inte...

Page 67: ...Intel Core 2 Duo processor With the proper configuration information the ME can accommodate inputs from PECI or SST for the processor socket Additional SST sensors can be added to monitor system thermal see 0 for BTX recommendations for placement Figure 7 4 Example Acoustic Fan Speed Control Implementation Intel has engaged with a number of major manufacturers of thermal voltage sensors to provide...

Page 68: ...ontrol between Intel QST and the thermistor however they can work in tandem to provide the maximum fan speed reduction The BTX reference design includes a thermistor on the fan hub This Variable Speed Fan curve will determine the maximum fan speed as a function of the inlet ambient temperature and by design provides a ΨCA sufficient to meet the thermal profile of the processor Intel QST by measuri...

Page 69: ...uated In addition solder joint shear stress is caused by coefficient of thermal expansion CTE mismatch induced shear loading The solder joint compressive axial force Faxial induced by the heatsink preload helps to reduce the combined joint tensile and shear stress Overall the heatsink required preload is the minimum preload needed to meet all of the above requirements Mechanical shock and vibratio...

Page 70: ...on metric provides guidance for mechanical designs that differ from the reference design for ATX µATX form factor A 3 1 Motherboard Deflection Metric Definition Motherboard deflection is measured along either diagonal refer to Figure 7 6 d dmax d1 d2 2 d dmax d 1 d 2 2 Configurations in which the deflection is measured are defined in the Table 7 1 To measure board deflection follow industry standa...

Page 71: ...on Limits Deflection limits for the ATX µATX form factor are d_BOL d_ref 0 09 mm and d_EOL d_ref 0 15 mm And d _BOL d _ref 0 09 mm and d_EOL d_ref 0 15 mm NOTES 1 The heatsink preload must remain within the static load limits defined in the processor datasheet at all times 2 Board deflection should not exceed motherboard manufacturer specifications ...

Page 72: ...e creep phenomenon The example accounts for the creep expected to occur in the motherboard It assumes no creep to occur in the clip However there is a small amount of creep accounted for in the plastic fasteners This situation is somewhat similar to the reference design The impact of the creep to the board deflection is a function of the clip stiffness The relatively compliant clips store strain e...

Page 73: ...deflect 0 37 mm minimum at BOL Additional deflection as high as 0 09 mm may be necessary to account for additional creep effects impacting the board clip fastener assembly As a result designs could see as much as 0 50 mm total downward board deflection under the socket In addition to board deflection other elements need to be considered to define the space needed for the downward board total displ...

Page 74: ... to meet the board deflection recommendation refer to Section A 3 2 with a very stiff board may lead to heatsink preloads exceeding package maximum load specification For example such a situation may occur when using a backing plate that is flush with the board in the socket area and prevents the board to bend underneath the socket A 4 Heatsink Selection Guidelines Evaluate carefully heatsinks com...

Page 75: ...e distributed evenly as close as possible to the pocket walls Apply wax around the circumference of each load cell and the surface of the pocket around each cell to maintain the load cells in place during the heatsink installation on the processor and motherboard Refer to Figure 7 9 The depth of the pocket depends on the height of the load cell used for the test It is necessary that the load cells...

Page 76: ...ign is Machine the pocket in the heat sink base to a depth such that the tips of the load cells are just flush with the heat sink base Then machine back the heatsink base by around 0 25 mm 0 01 so that the load cell tips protrude beyond the base Proceeding this way the original stack height of the heatsink assembly should be preserved This should not affect the stiffness of the heatsink significan...

Page 77: ...Heatsink Base Pocket Side View Figure 7 10 Preload Test Configuration Load Cells 3x Preload Fixture copper core with milled out pocket Wax to maintain load cell in position during heatsink installation Height of pocket height of selected load cell Load cell protrusion Note to be optimized depending on assembly stiffness ...

Page 78: ...rding and control with a 6101 PCI card GPIB added to the scanner allowing it to be connected to a PC running LabVIEW or Vishay s StrainSmart software 4 IMPORTANT In addition to just a zeroing of the force reading at no applied load it is important to calibrate the load cells against known loads Load cells tend to drift Contact your load cell vendor for calibration tools and procedure information 5...

Page 79: ...time to allow the load cell to settle is generally specified by the load vendors often of order of 3 minutes The time zero reading should be taken at the end of this settling time 5 Record the preload measurement total from all three load cells at the target time and average the values over 10 seconds around this target time as well that is in the interval for example over target time 5 seconds ta...

Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines ...

Page 81: ...ea do not translate to a measurable improvement in thermal performance C 3 Interface Material Performance Two factors impact the performance of the interface material between the processor and the heatsink base Thermal resistance of the material Wetting filling characteristics of the material Thermal resistance is a description of the ability of the thermal interface material to transfer heat from...

Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines ...

Page 83: ...e IHS followed by the reference procedure The supplier is listed the table below as a convenience to Intel s general customers and the list may be subject to change without notice Supplier Contact Phone Email Address THERM X OF CALIFORNIA Ernesto B Valencia 510 441 7566 Ext 242 ernestov therm x com 1837 Whipple Road Hayward Ca 94544 D 2 Supporting Test Equipment To apply the reference thermocouple...

Page 84: ...formation OSK2K1280 5SR TC TT T 36 72 Calibration and Control Ice Point Cell Omega stable 0 ºC temperature source for calibration and offset TRCIII Hot Point Cell Omega temperature source to control and understand meter slope gain CL950 A 110 NOTES 1 The Solder Station consisting of the Heater Block Heater Press and Transformer are available from Jemelco Engineering 480 804 9514 2 This part number...

Page 85: ...vily impacted by impedance There are numerous resources available throughout the industry to assist with implementation of proper controls for thermal measurements NOTES 1 It is recommended to follow company standard procedures and wear safety items like glasses for cutting the IHS and gloves for chemical handling 2 Ask your Intel field sales representative if you need assistance to groove and or ...

Page 86: ...Case Temperature Reference Metrology 86 Thermal and Mechanical Design Guidelines Figure 7 12 775 LAND LGA Package Reference Groove Drawing at 6 o clock Exit ...

Page 87: ...Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 87 Figure 7 13 775 LAND LGA Package Reference Groove Drawing at 3 o clock Exit Old Drawing ...

Page 88: ...notch as shown Figure 7 15 Figure 7 15 IHS Groove at 6 o clock Exit Orientation Relative to the LGA775 Socket Select a machine shop that is capable of holding drawing specified tolerances IHS groove geometry is critical for repeatable placement of the thermocouple bead ensuring precise thermal measurements The specified dimensions minimize the impact of the groove on the IHS under the socket load ...

Page 89: ...le Attach Using Solder Video CD ROM is available D 5 1 Thermocouple Conditioning and Preparation 1 Use a calibrated thermocouple as specified in Sections D 2 and D 3 2 Under a microscope verify the thermocouple insulation meets the quality requirements The insulation should be about 1 16 inch 0 062 0 030 from the end of the bead Figure 7 16 Figure 7 16 Inspection of Insulation on Thermocouple 3 Me...

Page 90: ... groove and IHS with Isopropyl Alcohol IPA and a lint free cloth removing all residues prior to thermocouple attachment 7 Place the thermocouple wire inside the groove letting the exposed wire and bead extend about 1 5 mm 0 030 inch past the end of groove Secure it with Kapton tape Figure 7 18 Clean the IHS with a swab and IPA 8 Verify under the microscope that the thermocouple wires are straight ...

Page 91: ...thermocouple in the groove ensuring the tip is in contact with the end and bottom of the groove in the IHS Figure 7 19 A and B Figure 7 19 Thermocouple Bead Placement A B 10 Place the package under the microscope to continue with process It is also recommended to use a fixture like processor tray or a plate to help holding the unit in place for the rest of the attach process ...

Page 92: ... using the tweezers or your finger Place a piece of Kapton tape to hold the wire inside the groove Figure 7 20 Refer to Figure 7 21 for detailed bead placement Figure 7 20 Position Bead on the Groove Step Figure 7 21 Detailed Thermocouple Bead Placement TC Wire with Insulation IHS with Groove TC Bead Wire section into the groove to prepare for final bead placement Kapton tape ...

Page 93: ... 22 This tape will create a solder dam to prevent solder from flowing into the larger IHS groove section during the melting process 13 Measure resistance from thermocouple end wires hold both wires to a DMM probe to the IHS surface This should be the same value as measured during the thermocouple conditioning Section D 5 1 step 3 Figure 7 23 Figure 7 23 Measuring Resistance between Thermocouple an...

Page 94: ...e bead Be careful not to move the thermocouple bead during this step Figure 7 24 Ensure the flux remains in the bead area only Figure 7 24 Applying Flux to the Thermocouple Bead 15 Cut two small pieces of solder 1 16 inch 0 065 inch 1 5 mm from the roll using tweezers to hold the solder while cutting with a fine blade Figure 7 25 Figure 7 25 Cutting Solder ...

Page 95: ... 1 step 2 to ensure the bead is still properly contacting the IHS D 5 3 Solder Process 18 Make sure the thermocouple that monitors the Solder Block temperature is positioned on the Heater block Connect the thermocouple to a handheld meter to monitor the heater block temperature 19 Verify the temperature of the Heater block station has reached 155 C 5 C before you proceed 20 Connect the thermocoupl...

Page 96: ...ote Do not touch the copper heater block at any time as this is very hot 22 Move a magnified lens light close to the device in the solder status to get a better view when the solder begins to melt 23 Lower the Heater block onto the IHS Monitor the device IHS temperature during this step to ensure the maximum IHS temperature is not exceeded Note The target IHS temperature during reflow is 150 C 3 C...

Page 97: ...to move the solder back toward the groove as the IHS begins to heat Use a fine tip tweezers to push the solder into the end of the groove until a solder ball is built up Figure 7 28 and Figure 7 29 Figure 7 28 View Through Lens at Solder Station Figure 7 29 Moving Solder back onto Thermocouple Bead ...

Page 98: ...ure with a handheld meter until it drops below 50 C before moving it to the microscope for the final steps D 5 4 Cleaning and Completion of Thermocouple Installation 27 Remove the device from the solder station and continue to monitor IHS Temperature with a handheld meter Place the device under the microscope and remove the three pieces of Kapton tape with Tweezers keeping the longest for re use 2...

Page 99: ...blade carefully shave the excess solder above the IHS surface Only shave in one direction until solder is flush with the groove surface Figure 7 32 Figure 7 32 Removing Excess Solder Note Take usual precautions when using open blades 30 Clean the surface of the IHS with Alcohol and use compressed air to remove any remaining contaminants ...

Page 100: ...erify under the microscope that the thermocouple wire is below the surface along the entire length of the IHS groove Figure 7 33 Figure 7 33 Filling Groove with Adhesive 32 To speed up the curing process apply Loctite Accelerator on top of the Adhesive and let it set for a couple of minutes Figure 7 34 Figure 7 34 Application of Accelerant ...

Page 101: ...t This will help to keep the adhesive surface flat and smooth with no pits or voids If there are voids in the adhesive refill the voids with adhesive and shave a second time 34 Clean IHS surface with IPA and a wipe 35 Clean the LGA pads with IPA and a wipe 36 Replace the land side cover on the device 37 Perform a final continuity test 38 Wind the thermocouple wire into loops and secure or if provi...

Page 102: ...be wrong For example if there are any cuts into the wires insulation where the wires are pinched between the heatsink and the socket lid when installing the heatsink the thermocouple wires can get in contact at this location In that case the reported temperature would be the point of the heatsink socket lid area This temperature is usually much lower than the temperature at the center of the IHS P...

Page 103: ...onents For instance it may be useful to monitor the temperature near the PSU airflow inlet near the graphics add in card or near memory The final system integrator is typically responsible for ensuring compliance with the component temperature specifications at all operating conditions and therefore should be responsible for specifying the System Monitor thermal sensor location However it is not a...

Page 104: ...ermal sensor The following thermal sensor or its equivalent can be used for this function Part Number C83274 002 BizLink USA Technology Inc 44911 Industrial Drive Fremont CA 94538 USA 510 252 0786 phone 510 252 1178 fax sales bizlinktech com Part Number 68801 0170 Molex Incorporated 2222 Wellington Ct Lisle IL 60532 1 800 78MOLEX phone 1 630 969 1352 fax amerinfo molex com Figure 7 38 System Airfl...

Page 105: ...Balanced Technology Extended BTX System Thermal Considerations Thermal and Mechanical Design Guidelines 105 Figure 7 39 Thermal sensor Location Illustration TMA Airflow Thermal Sensor MCH Heatsink ...

Page 106: ...Balanced Technology Extended BTX System Thermal Considerations 106 Thermal and Mechanical Design Guidelines ...

Page 107: ...voltage for logic low VIL 0 8 V PWM compliant function RPM must be within spec for specified duty cycle In addition to comply with overall thermal requirements Sections 5 1 1 and 6 2 and the general environmental reliability requirements Sections 5 2 and 6 3 the fan should meet the following performance requirements Mechanical wear out represents the highest risk reliability parameter for fans The...

Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines ...

Page 109: ...ATX Motherboard Keep out Footprint Definition and Height Restrictions for Enabling Components Sheet 2 111 ATX µATX Motherboard Keep out Footprint Definition and Height Restrictions for Enabling Components Sheet 3 112 BTX Thermal Module Keep Out Volumetric Sheet 1 113 BTX Thermal Module Keep Out Volumetric Sheet 2 114 BTX Thermal Module Keep Out Volumetric Sheet 3 115 BTX Thermal Module Keep Out Vo...

Page 110: ... 25 0MMMAXCOMPONENTHEIGHT 1 8MMMAXCOMPONENTHEIGHT BOARDROUTINGKEEP OUT SHEET 1 OF 3 DONOTSCALEDRAWING SCALE NONE 3 C40819 D REV DRAWINGNUMBER CAGE CODE SIZE LGA775microATX COMPONENTKEEP INS TITLE 2200MISSIONCOLLEGEBLVD P O BOX58119 SANTACLARA CA95052 8119 CORP R DEPARTMENT N A FINISH N A MATERIAL DATE APPROVEDBY DATE APPROVEDBY DATE CHECKEDBY DATE DESIGNEDBY UNLESSOTHERWISESPECIFIED INTERPRETDIMEN...

Page 111: ...ENTS MAYNOTBEDISCLOSED REPRODUCED DI SPLAYEDORMODIFIED WITHOUTTHEPRI ORWRITTENCONSENTOFINTEL CORPORAT ION 4X 6 00 4X 10 00 LEGEND COMPONENTKEEP OUT ROUTINGKEEP OUT SHEET 2 OF 3 DONOTSCALEDRAWING SCALE NONE 2200MISSIONCOLLEGEBLVD P O BOX58119 SANTACLARA CA95052 8119 CORP R TMD 3 C40819 D REV DRAWINGNUMBER CAGECODE SIZE DEPARTMENT C40819 2 3 DWG NO SHT REV SOCKETBALL1 COMPONENTVOLUMETRIC KEEP INS RO...

Page 112: ...CLARA CA95052 8119 CORP R TMD 3 C40819 D REV DRAWINGNUMBER CAGECODE SIZE DEPARTMENT C40819 3 3 DWG NO SHT REV LEVERMOTIONSPACE REQUIREDTORELEASE SOCKETLOADPLATE NOTES 1 SOCKETCENTERPLANESAREREFERENCEDFROMGEOMETRIC CENTEROFSOCKETHOUSINGCAVITYFORCPUPACKAGE ALIGNES WITHDATUMREFERENCEGIVENFORBOARDCOMPONENTKEEP INS 2 SOCKETKEEP INVOLUMEVERTICALHEIGHTESTABLISHESLIMITOFSOCKET ANDCPUPACKAGEASSEMBLYINTHESO...

Page 113: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 113 Figure 7 43 BTX Thermal Module Keep Out Volumetric Sheet 1 ...

Page 114: ...Mechanical Drawings 114 Thermal and Mechanical Design Guidelines Figure 7 44 BTX Thermal Module Keep Out Volumetric Sheet 2 ...

Page 115: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 115 Figure 7 45 BTX Thermal Module Keep Out Volumetric Sheet 3 ...

Page 116: ...Mechanical Drawings 116 Thermal and Mechanical Design Guidelines Figure 7 46 BTX Thermal Module Keep Out Volumetric Sheet 4 ...

Page 117: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 117 Figure 7 47 BTX Thermal Module Keep Out Volumetric Sheet 5 ...

Page 118: ...WINGTOBEUSEDINCONJUNTIONWITHSUPPLIED3D DATABASEFILE ALLDIMENSIONSANDTOLERANCESONTHIS DRAWINGTAKEPRECEDENCEOVERSUPPLIEDFILEANDARE APPLICABLEATPARTFREE UNCONSTRAINEDSTATEUNLESS INDICATEDOTHERWISE 2 MATERIAL A TYPE AISI 1065COLDDRAWNSTEELOREQUIVALENT 1 6MMTHICKNESS B CRITICALMECHANICALMATERIALPROPERTIES FOREQUIVALENTMATERIALSELECTION ELASTICMODULUS 206 8GPA 29 900KSI MINTENSILEYIELDSTRENGTH ASTMD638 ...

Page 119: ... 4 055 R3 1 122 45 X 8 0 45 0 05 018 001 45 X 8 0 25 0 05 010 001 C85609 2 0 DWG NO SHT REV DEPARTMENT R CORP 2200MISSIONCOLLEGEBLVD P O BOX58119 SANTACLARA CA95052 8119 TMD SIZE DRAWINGNUMBER REV A1 C85609 0 SCALE 1 DONOTSCALEDRAWING SHEET 2 OF 2 DETAIL A SCALE 10 TYPICAL4PLACES 0 1 003 A B 0 2 007 A B DETAIL C SCALE 10 TYP4PLACES DETAIL B SCALE 20 THISPOINTCORRESPONDSTOTHE39 6 DIMENSIONONSHEET1Z...

Page 120: ...Mechanical Drawings 120 Thermal and Mechanical Design Guidelines Figure 7 50 Reference Fastener Sheet 1 ...

Page 121: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 121 Figure 7 51 Reference Fastener Sheet 2 ...

Page 122: ...Mechanical Drawings 122 Thermal and Mechanical Design Guidelines Figure 7 52 Reference Fastener Sheet 3 ...

Page 123: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 123 Figure 7 53 Reference Fastener Sheet 4 ...

Page 124: ...Mechanical Drawings 124 Thermal and Mechanical Design Guidelines Figure 7 54 Intel E18764 001 Reference Solution Assembly ...

Page 125: ...listed below identifies these reference components End users are responsible for the verification of the Intel enabled component offerings with the supplier OEMs and System Integrators are responsible for thermal mechanical and environmental validation of these solutions Table 7 5 E18764 001 Reference Thermal Solution Providers Supplier Part Description Supplier P N Contact Phone Email Foxconn Int...

Page 126: ...rusion TBD Harry Lin Monica Chih 714 739 5797 886 2 29952666 Extension 131 AVC ASIA Vital Components Co Ltd Fan and Duct TBD David Chao 886 2 22996930 Extension 619 NOTES 1 Part numbers were not available at the time of release of this document Contact the company for part number identification prior to the next revision of this document 2 The user should note that for the 2004 Type I Intel refere...

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Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN, Design Manual

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