LGA775 Socket Heatsink Loading
70
Thermal and Mechanical Design Guidelines
Simulation shows that the solder joint force (F
axial
) is proportional to the board
deflection measured along the socket diagonal. The matching of F
axial
required to
protect the LGA775 socket solder joint in temperature cycling is equivalent to
matching a target MB deflection.
Therefore, the heatsink preload for LGA775 socket solder joint protection against
fatigue failure can be more generally defined as the load required to create a target
board downward deflection throughout the life of the product
This board deflection metric provides guidance for mechanical designs that differ from
the reference design for ATX//µATX form factor.
A.3.1
Motherboard Deflection Metric Definition
Motherboard deflection is measured along either diagonal (refer to Figure 7-6):
d = dmax – (d1 + d2)/2
d’ = dmax – (d’1 + d’2)/2
Configurations in which the deflection is measured are defined in the Table 7–1.
To measure board deflection, follow industry standard procedures (such as IPC) for
board deflection measurement. Height gauges and possibly dial gauges may also be
used.
Table 7–1. Board Deflection Configuration Definitions
Configuration
Parameter
Pro Socket
load plate
Heatsink
Parameter Name
d_ref
yes
no
BOL deflection, no preload
d_BOL
yes
yes
BOL deflection with preload
d_EOL
yes
yes
EOL deflection
NOTES:
BOL: Beginning of Life
EOL: End of Life
Summary of Contents for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines ...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines ...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines ...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines ...
