Case Temperature Reference Metrology
96
Thermal and Mechanical Design Guidelines
Figure 7-27. Solder Station Setup
21.
Remove the land side protective cover and place the device to be soldered in the
solder station. Make sure the thermocouple wire for the device being soldered is
exiting the heater toward you.
Note:
Do
not
touch the copper heater block at any time as this is very hot.
22.
Move a magnified lens light close to the device in the solder status to get a better
view when the solder begins to melt.
23.
Lower the Heater block onto the IHS. Monitor the device IHS temperature during
this step to ensure the maximum IHS temperature is not exceeded.
Note:
The target IHS temperature during reflow is 150° C ±3° C. At no time should the IHS
temperature exceed 155° C during the solder process as damage to the device may
occur.
Summary of Contents for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines ...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines ...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines ...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines ...
