Case Temperature Reference Metrology
92
Thermal and Mechanical Design Guidelines
11.
While still at the microscope, press the wire down about 6mm [0.125”] from the
thermocouple bead using the tweezers or your finger. Place a piece of Kapton*
tape to hold the wire inside the groove (Figure 7-20). Refer to Figure 7-21 for
detailed bead placement.
Figure 7-20. Position Bead on the Groove Step
Figure 7-21. Detailed Thermocouple Bead Placement
TC Wire with Insulation
IHS with Groove
TC Bead
Wire section
into the
groove to
prepare for
final bead
placement
Kapton*
tape
Summary of Contents for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines ...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines ...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines ...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines ...
