Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
95
16.
Place the two pieces of solder in parallel, directly over the thermocouple bead
(Figure 7-26).
Figure 7-26. Positioning Solder on IHS
17.
Measure the resistance from the thermocouple end wires again using the DMM
(refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the
IHS.
D.5.3
Solder Process
18.
Make sure the thermocouple that monitors the Solder Block temperature is
positioned on the Heater block. Connect the thermocouple to a handheld meter to
monitor the heater block temperature
19.
Verify the temperature of the Heater block station has reached 155° C ±5° C
before you proceed.
20.
Connect the thermocouple for the device being soldered to a second hand held
meter to monitor IHS temperature during the solder process.
Summary of Contents for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines ...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines ...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines ...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines ...
