Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
89
D.5
Thermocouple Attach Procedure
The procedure to attach a thermocouple with solder takes about 15 minutes to
complete. Before proceeding turn on the solder block heater, as it can take up to
30 minutes to reach the target temperature of 153 – 155° C.
Note:
To avoid damage to the processor ensure the IHS temperature does not exceed
155° C.
As a complement to the written procedure a video
Thermocouple Attach Using Solder
– Video CD-ROM
is available.
D.5.1
Thermocouple Conditioning and Preparation
1.
Use a calibrated thermocouple as specified in Sections D.2 and D.3.
2.
Under a microscope verify the thermocouple insulation meets the quality
requirements. The insulation should be about 1/16
inch (0.062 ± 0.030) from the
end of the bead (Figure 7-16).
Figure 7-16. Inspection of Insulation on Thermocouple
3.
Measure the thermocouple resistance by holding both contacts on the connector
on one probe and the tip of thermocouple to the other probe of the DMM
(measurement should be about ~3.0 ohms for 36-gauge type T thermocouple).
4.
Straighten the wire for about 38 mm [1 ½ inch] from the bead.
Summary of Contents for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines ...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines ...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines ...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines ...
