Mechanical Drawings
112
Thermal and Mechanical Design Guidelines
Figure 7-42. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 3
1
3
4
5
6
7
8
B
C
D
A
1
2
3
4
5
6
7
8
B
C
D
A
THIS DRAWING CONTAINS INTEL CORPORAT
ION CONFIDENTIAL INFORMATION. IT IS
DISCLOSED IN CONFIDENCE AND ITS CONT
ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI
SPLAYED OR MODIFIED, WITHOUT THE PRI
OR WRITTEN CONSENT OF INTEL CORPORAT
ION.
A
A
5.80
5.80
3.00
2.75
3.80
30.00
R49.44
R33.29
2
8.15
27.25
3.00
19.25
37.00
29.00
32.85
24.50
49.00
2X
45 X 3.00
45 X 3.50
2.50
3.00
14.10
14.60
6.60
6.60
3.80
120.0
1.00
(
)
37.60
(
)
37.60
(
)
16.87
(
)
16.00
(
)
46.11
(
)
55.58
SHEET 3 OF 3
DO NOT SCALE DRAWING
SCALE: NONE
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
CORP.
R
TMD
3
C40819
D
REV
DRAWING NUMBER
CAGE CODE
SIZE
DEPARTMENT
C40819
3
3
DWG. NO
SHT.
REV
LEVER MOTION SPACE
REQUIRED TO RELEASE
SOCKET LOAD PLATE
NOTES:
1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC
CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE (ALIGNES
WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP-INS).
2 SOCKET KEEP-IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET
AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSITION.
IT ENCOMPASSES SOCKET AND CPU PACKAGE DIMENSIONAL TOLERANCES
AND DEFLECTION / SHAPE CHANGES DUE TO DSL LOAD.
3. SOCKET KEEP-IN VOLUME ENCOMPASS THE SOCKET NOMINAL VOLUME
AND ALLOWANCES FOR SIZE TOLERANCES. THERMAL/MECHANICAL COMPONENT
DEVELOPERS SHALL DESIGN TO THE OUTSIDE OF SOCKET KEEP IN VOLUME WITH
CLEARANCE MARGINS. SOCKET DEVELOPERS SHALL DESIGN TO THE INSIDE VOLUME.
SOCKET & PROCESSOR VOLUMETRIC KEEP-IN
TOP SIDE VIEW
BOTTOM SIDE VIEW
1
SOCKET HOUSING
1
CAVITY (CPU PACKAGE)
SOCKET BALL 1
LEVER MOTION SPACE
REQUIRED TO RELEASE
SOCKET LOAD PLACE
(FARSIDE)
SECTION A-A
Summary of Contents for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines ...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines ...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines ...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines ...
