Processor Thermal/Mechanical Information
Thermal and Mechanical Design Guidelines
13
2
Processor Thermal/Mechanical
Information
2.1
Mechanical Requirements
2.1.1
Processor Package
The processors covered in the document are packaged in a 775-Land LGA package
that interfaces with the motherboard using a LGA775 socket. Refer to the
datasheet
for detailed mechanical specifications.
The processor connects to the motherboard through a land grid array (LGA) surface
mount socket. The socket contains 775 contacts arrayed about a cavity in the center
of the socket with solder balls for surface mounting to the motherboard. The socket is
named LGA775 socket. A description of the socket can be found in the
LGA775 Socket
Mechanical Design Guide
.
The package includes an integrated heat spreader (IHS) that is shown in Figure 2-1
for illustration only. Refer to the processor datasheet for further information. In case
of conflict, the package dimensions in the processor datasheet supersedes dimensions
provided in this document.
Figure 2-1. Package IHS Load Areas
Summary of Contents for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines ...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines ...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines ...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines ...
