Processor Thermal/Mechanical Information
Thermal and Mechanical Design Guidelines
23
In addition to passive heatsinks, fan heatsinks and system fans are other solutions
that exist for cooling integrated circuit devices. For example, ducted blowers, heat
pipes, and liquid cooling are all capable of dissipating additional heat. Due to their
varying attributes, each of these solutions may be appropriate for a particular system
implementation.
To develop a reliable, cost-effective thermal solution, thermal characterization and
simulation should be carried out at the entire system level, accounting for the thermal
requirements of each component. In addition, acoustic noise constraints may limit the
size, number, placement, and types of fans that can be used in a particular design.
To ease the burden on thermal solutions, the Thermal Monitor feature and associated
logic have been integrated into the silicon of the processor. By taking advantage of
the Thermal Monitor feature, system designers may reduce thermal solution cost by
designing to TDP instead of maximum power. Thermal Monitor attempts to protect the
processor during sustained workload above TDP. Implementation options and
recommendations are described in Chapter 4.
2.4.3
Summary
In summary, considerations in heatsink design include:
•
The local ambient temperature T
A
at the heatsink, which is a function of chassis
design.
•
The thermal design power (TDP) of the processor, and the corresponding
maximum T
C
as calculated from the thermal profile. These parameters are usually
combined in a single lump cooling performance parameter,
Ψ
CA
(case to air
thermal characterization parameter). More information on the definition and the
use of
Ψ
CA
is given Section 3.1.
•
Heatsink interface to IHS surface characteristics, including flatness and roughness.
•
The performance of the thermal interface material used between the heatsink and
the IHS.
•
The required heatsink clip static load, between 18 lbf to 70 lbf throughout the life
of the product (Refer to Section 2.1.2.2 for further information).
•
Surface area of the heatsink.
•
Heatsink material and technology.
•
Volume of airflow over the heatsink surface area.
•
Development of airflow entering and within the heatsink area.
•
Physical volumetric constraints placed by the system
2.5
System Integration Considerations
Manufacturing with Intel
®
Components using 775–Land LGA Package and LGA775
Socket
documentation provides Best Known Methods for all aspects LGA775 socket
based platforms and systems manufacturing. Of particular interest for package and
heatsink installation and removal is the
System Assembly
module. A video covering
system integration is also available. Contact your Intel field sales representative for
further information.
§
Summary of Contents for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines ...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines ...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines ...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines ...
