Processor Thermal/Mechanical Information
16
Thermal and Mechanical Design Guidelines
2.1.2.3
Additional Guidelines
In addition to the general guidelines given above, the heatsink attach mechanism for
the processor should be designed to the following guidelines:
•
Holds the heatsink in place under mechanical shock and vibration events and
applies force to the heatsink base to maintain desired pressure on the thermal
interface material. Note that the load applied by the heatsink attach mechanism
must comply with the package specifications described in the processor datasheet.
One of the key design parameters is the height of the top surface of the processor
IHS above the motherboard. The IHS height from the top of board is expected to
vary from 7.517 mm to 8.167 mm. This data is provided for information only, and
should be derived from:
The height of the socket seating plane above the motherboard after reflow, given
in the LGA775 Socket Mechanical Design Guide with its tolerances.
The height of the package, from the package seating plane to the top of the IHS,
and accounting for its nominal variation and tolerances that are given in the
corresponding processor datasheet.
•
Engages easily, and if possible, without the use of special tools
. In general, the
heatsink is assumed to be installed after the motherboard has been installed into
the chassis.
•
Minimizes contact with the motherboard surface during installation
and actuation
to avoid scratching the motherboard.
2.2
Thermal Requirements
Refer to the datasheet
for the processor thermal specifications. The majority of
processor power is dissipated through the IHS. There are no additional components
(such as BSRAMs) that generate heat on this package. The amount of power that can
be dissipated as heat through the processor package substrate and into the socket is
usually minimal.
The thermal limits for the processor are the Thermal Profile and T
CONTROL
. The Thermal
Profile defines the maximum case temperature as a function of power being
dissipated. T
CONTROL
is a specification used in conjunction with the temperature
reported by the digital thermal sensor and a fan speed control method. Designing to
these specifications allows optimization of thermal designs for processor performance
and acoustic noise reduction.
2.2.1
Processor Case Temperature
For the processor, the case temperature is defined as the temperature measured at
the geometric center of the package on the surface of the IHS. For illustration,
Figure 2-2 shows the measurement location for a 37.5 mm x 37.5 mm [1.474 in x
1.474 in] 775-Land LGA processor package with a 28.7 mm x 28.7 mm [1.13 in x
1.13 in] IHS top surface. Techniques for measuring the case temperature are detailed
in Section 3.4.
Summary of Contents for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines ...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines ...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines ...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines ...
