Figure 44.
Air-Cooled Heatsink Assembly
A.17. Board Operating Conditions
The board should be designed to operate within the below conditions while keeping
the FPGA die temperature within its recommended operating T
J
as defined in the Intel
Agilex Device Data Sheet (usually 100°C).
Table 10.
Board Operating Conditions
Operating Condition
Range
Maximum power dissipation
250W
Maximum ambient temperature
0°C to 35°C
FPGA junction temperature
85°C
A.18. Over Temperature Warning LED
A red colored LED (D9) is connected to the Intel MAX 10 to indicate when an over
temperature fault condition has been detected. The Intel MAX 10 can turn on this LED
to indicate an over temperature warning.
A. Development Kits Components
683288 | 2022.09.22
Intel
®
Agilex
™
I-Series FPGA Development Kit User Guide
57
