Figure 42.
Mechanical Requirements
2.35
[0.093]
See Note 6
Detail E
Scale 7.000
0.35
[0.014]
5.25
[0.2.7]
13.40
[0.528]
Datum W
11.65
[0.459]
3.65
[0.144]
R1.59
[0.063]
0.64
[0.025]
8.25
[0.325]
(2 Places)
2.03 Max [0.080]
Restricted Component
Height Both Sides
8.89 Typ
[0.350]
0.64
[0.025]
See Note 2
Full Radius
3.45
[0.136]
See Note 7
Configuration
Single Slot
Dual Slot
Triple Slot
Primary Side
Height Restriction
14.47 Max
[0.570]
34.80 Max
[1.370]
55.12 Max
[2.170]
Detail F
Scale 3000
Restricted
Component
Height
See Table
for Details
2.67 Max (0.105)
Restricted
Component
Height
Secondary
(Solder)
Side
1.57 Ref
(0.062)
Primary
(Component)
Side
Datum V
A.16. Board Thermal Requirements
A thermal solution is designed to cool up to 250W total power of the board. An active
cooling design is used. The heatsink is designed to meet the height constraints of a 2-
slot PCIe card form-factor as defined by the PCIe CEM specification revision 3.0.
Figure 43.
Board Thermal Requirements
Restricted
Component
Height
See Table
for Details
2.67 Max (0.105)
Restricted
Component
Height
Secondary
(Solder)
Side
1.57 Ref
(0.062)
Primary
(Component)
Side
Datum V
Configuration
Single Slot
Dual Slot
Triple Slot
Primary Side
Height Restriction
14.47 Max
[0.570]
34.80 Max
[1.370]
55.12 Max
[2.170]
Detail F
Scale 3000
The heatsink is securely mounted to the board using screws for easy assembly and
removal. A thermal material is also used between the FPGA and heatsink to ensure
good thermal contact.
A. Development Kits Components
683288 | 2022.09.22
Intel
®
Agilex
™
I-Series FPGA Development Kit User Guide
56
