The following power rails are monitored:
1. VCC, VCCP (Power sensing by I2C on ED8401
2. 0.8V (Power sensing by I2C on EM2120L (U72)
3. 1.2V (Power sensing by I2C on EM2120L (U65)
4. 0.9V (Power sensing by I2C on EN2340L (U70)
5. 3.3V (Power sensing by I2C on EM2130H (U64)
A.14. Temperature Monitoring
Temperature monitoring of the Intel Agilex FPGA device is done by a pair of
MAX3 temperature sense devices. The Intel Agilex I-Series device has 6 die
temperature diodes that can be monitored via external temperature sensing devices.
The MAX3 senses these diodes and convert the signals to digital form for
the Intel MAX 10 to read via a I2C bus. Additionally, the
THERMn
signal from the
MAX3 are brought to the Intel MAX 10 to allow it to immediately sense a
temperature fault condition. An over temperature warning LED D9 (Red-colored) is
controlled by the Intel MAX 10 device to indicate an over temperature warning.
Temperature fault set points can be programmed into the temperature sensing device.
Figure 41.
Board Temperature Measurement Circuit
DXP1
EU1
DXN1
DXP2
DXN2
DXP3
DXN3
SDA
SCL
VDD
1
2
3
4
5
6
7
11
12
9
10
8
13
3p3V_STBY
3p3V_STBY
THERM
ADD
GND
GND_EP
MAX3
C570
0.1µF
I2C ADDR = 3A
TEMP2_THERMn 51
750
1%
R476
10.0K
???
<IFN>
DXP1
EU2
DXN1
DXP2
DXN2
DXP3
DXN3
SDA
SCL
VDD
THERM
ADD
GND
GND_EP
MAX3
<IFN>
35 FPGA_Temp0Ap
35 FPGA_Temp0An
29 FPGA_Temp0Cp
29 FPGA_Temp0Cn
28 FPGA_Temp1p
28 FPGA_Temp1n
R454
C584 100pf
C588 100pf
C563 100pf
R454
R458
R458
R459
R461
0
0
0
0
0
0
27, 32, 46, 50, 52 I2C2_SDA
27, 32, 46, 50, 52 I2C2_SCL
2
3
4
5
6
7
11
12
31 FPGA_Temp3p
31 FPGA_Temp3n
33 FPGA_Temp6p
33 FPGA_Temp6n
34 FPGA_Temp4p
R Tile
14C
R Tile
15C
R Tile
15A
34 FPGA_Temp4n
R470
C569 100pf
C571 100pf
C568 100pf
R471
R472
R473
R474
R475
0
0
0
0
DNI
DNI
27, 32, 46, 50, 52 I2C2_SDA
27, 32, 46, 50, 52 I2C2_SCL
1
9
10
8
13
3p3V_STBY
3p3V_STBY
C565
0.1µF
I2C ADDR = 38
TEMP1_THERMn 51
R460
0
10.0K
R453
A.15. Mechanical Requirements
The board is a PCIe standard-height (4.376 in tall), 10” long, dual-slot (1.37 in high
above the top surface of the PCB) form factor as defined by the PCIe CEM specification
Revision 3.0.
A. Development Kits Components
683288 | 2022.09.22
Intel
®
Agilex
™
I-Series FPGA Development Kit User Guide
55
