MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
10
Freescale Semiconductor
Electrical Characteristics
2.1.2
Power Supply Voltage Specification
Table 2
provides the recommended operating conditions for the device. Note that the values in
Table 2
are
the recommended and tested operating conditions. Proper device operation outside of these conditions is
not guaranteed.
Table 2. Recommended Operating Conditions
Characteristic
Symbol
Recommended
Value
Unit
Notes
Core supply voltage
For QUICC Engine module frequencies <500 MHz and e300
frequencies <667 MHz
For a QUICC Engine module frequency of 500 MHz or an e300
frequency of 667 MHz
V
DD
1.2 V ± 60 mV
1.3 V ± 50 mV
V
1
PLL supply voltage
For QUICC Engine module frequencies <500 MHz and e300
frequencies <667 MHz
For a QUICC Engine module frequency of 500 MHz or an e300
frequency of 667 MHz
AV
DD
1.2 V ± 60 mV
1.3 V ± 50 mV
V
1
DDR and DDR2 DRAM I/O supply voltage
DDR
DDR2
GV
DD
2.5 V ± 125 mV
1.8 V ± 90 mV
V
—
Three-speed Ethernet I/O supply voltage
LV
DD
0
3.3 V ± 330 mV
2.5 V ± 125 mV
V
—
Three-speed Ethernet I/O supply voltage
LV
DD
1
3.3 V ± 330 mV
2.5 V ± 125 mV
V
—
Three-speed Ethernet I/O supply voltage
LV
DD
2
3.3 V ± 330 mV
2.5 V ± 125 mV
V
—
PCI, local bus, DUART, system control and power management, I
2
C, SPI,
and JTAG I/O voltage
OV
DD
3.3 V ± 330 mV
V
—
Junction temperature
T
J
0 to 105
– 40 to 105
°
C
2
Notes:
1. GV
DD
, LV
DD
, OV
DD
, AV
DD
, and V
DD
must track each other and must vary in the same direction—either in the positive or
negative direction.
2. The operating conditions for junction temperature, T
J
, on the 600/333/400 MHz and 500/333/500 MHz on rev. 2.0 silicon is
0
°
to 70
°
C. Refer to Errata General9 in
Chip Errata for the MPC8360E, Rev. 1.