Texas Instruments SimpleLink CC2652PSIP, Руководство пользователя, Страница: 5 / 68

Table of Contents
1 Features ............................................................................ 1
2 Applications ..................................................................... 2
3 Description ....................................................................... 2
4 Functional Block Diagram .............................................. 3
5 Revision History .............................................................. 5
6 Device Comparison ......................................................... 6
7 Terminal Configuration and Functions .......................... 7
7.1 Pin Diagram................................................................ 7
7.2 Signal Descriptions – SIP Package............................ 8
7.3 Connections for Unused Pins and Modules................ 9
8 Specifications ................................................................ 10
8.1 Absolute Maximum Ratings...................................... 10
8.2 ESD Ratings............................................................. 10
8.3 Recommended Operating Conditions....................... 10
8.4 Power Supply and Modules...................................... 10
8.5 Power Consumption - Power Modes......................... 11
8.6 Power Consumption - Radio Modes......................... 12
8.7 Nonvolatile (Flash) Memory Characteristics............. 12
8.8 Thermal Resistance Characteristics......................... 12
8.9 RF Frequency Bands................................................ 13
8.10 Bluetooth Low Energy - Receive (RX).................... 13
8.11 Bluetooth Low Energy - Transmit (TX).................... 16
8.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4
GHz (OQPSK DSSS1:8, 250 kbps) - RX.................... 17
8.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4
GHz (OQPSK DSSS1:8, 250 kbps) - TX..................... 18
8.14 Timing and Switching Characteristics..................... 18
8.15 Peripheral Characteristics....................................... 23
8.16 Typical Characteristics............................................ 30
9 Detailed Description ...................................................... 38
9.1 Overview................................................................... 38
9.2 System CPU............................................................. 38
9.3 Radio (RF Core)........................................................ 39
9.4 Memory..................................................................... 39
9.5 Sensor Controller...................................................... 41
9.6 Cryptography............................................................ 42
9.7 Timers....................................................................... 43
9.8 Serial Peripherals and I/O......................................... 44
9.9 Battery and Temperature Monitor............................. 44
9.10 µDMA...................................................................... 44
9.11 Debug...................................................................... 44
9.12 Power Management................................................ 45
9.13 Clock Systems........................................................ 46
9.14 Network Processor.................................................. 46
9.15 Device Certification and Qualification..................... 47
9.16 Module Markings..................................................... 49
9.17 End Product Labeling.............................................. 49
9.18 Manual Information to the End User....................... 49
10 Application, Implementation, and Layout ................. 50
10.1 Application Information........................................... 50
10.2 Device Connection and Layout Fundamentals....... 51
10.3 PCB Layout Guidelines........................................... 51
10.4 Reference Designs................................................. 55
11 Environmental Requirements and SMT
Specifications ............................................................... 56
11.1 PCB Bending........................................................... 56
11.2 Handling Environment............................................. 56
11.3 Storage Condition................................................... 56
11.4 PCB Assembly Guide.............................................. 56
11.5 Baking Conditions................................................... 57
11.6 Soldering and Reflow Condition.............................. 58
12 Device and Documentation Support .......................... 59
12.1 Device Nomenclature.............................................. 59
12.2 Tools and Software................................................. 59
12.3 Documentation Support.......................................... 62
12.4 Support Resources................................................. 62
12.5 Trademarks............................................................. 62
12.6 Electrostatic Discharge Caution.............................. 63
12.7 Glossary.................................................................. 63
13 Mechanical, Packaging, and Orderable
Information .................................................................... 64
13.1 Packaging Information............................................ 64
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (February 2021) to Revision A (May 2022) Page
• Updated numbering of sections, figures, and tables throughout the data sheet................................................. 1
• Updated formatting throughout data sheet to match current documentation standards..................................... 1
• Devices are now PRODUCTION DATA.............................................................................................................. 1
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CC2652PSIP
SWRS263A – FEBRUARY 2021 – REVISED JUNE 2022
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