11.6 Soldering and Reflow Condition
• Heating method: Conventional convection or IR convection
• Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or
equivalent method
• Solder paste composition: SAC305
• Allowable reflow soldering times: 2 times based on the reflow soldering profile (see
• Temperature profile: Reflow soldering will be done according to the temperature profile (see
• Peak temperature: 260°C
Figure 11-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component (at Solder
Joint)
Table 11-1. Temperature Profile
Profile Elements
Peak temperature range
235 to 240°C typical (260°C maximum)
Pre-heat / soaking (150 to 200°C)
60 to 120 seconds
Time above melting point
60 to 90 seconds
Time with 5°C to peak
30 seconds maximum
Ramp up
< 3°C / second
Ramp down
< -6°C / second
(1)
For details, refer to the solder paste manufacturer's recommendation.
Note
TI does not recommend the use of conformal coating or similar material on the SimpleLink™ module.
This coating can lead to localized stress on the solder connections inside the module and impact
the module reliability. Use caution during the module assembly process to the final PCB to avoid the
presence of foreign material inside the module.
SWRS263A – FEBRUARY 2021 – REVISED JUNE 2022
58
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