ADV
ANCEINFORMA
TION
TMS320F28377S, TMS320F28376S, TMS320F28375S, TMS320F28374S
SPRS881A – AUGUST 2014 – REVISED JUNE 2015
2
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from August 21, 2014 to June 19, 2015 (from Original Revision (August 2014) to A Revision)
Page
•
Global:
Restructured document.
..................................................................................................
•
Global:
Removed Differential Mode for 12-bit ADC.
............................................................................
•
Global:
T temperature range (–40°C to 105°C) is Junction temperature (T
J
).
..............................................
•
Global:
S temperature range (–40°C to 125°C) is Junction temperature (T
J
).
..............................................
•
Global:
Q temperature range (–40°C to 150°C, Q100 qualification) is Junction temperature (T
J
).
.......................
•
Global:
Q temperature range (–40°C to 125°C, Q100 qualification) is Free-Air temperature (T
A
).
.......................
•
Global:
The Q temperature range is available only on the F28377S device.
...............................................
•
Global:
Changed t
c(SCO)
to t
c(SYSCLK)
...............................................................................................
•
Global:
Changed SYSCLKOUT to SYSCLK.
....................................................................................
•
Global:
Changed t
c(LCO)
to t
c(LSPCLK)
...............................................................................................
•
Global:
Removed "Comparator/DAC Electrical Characteristics" table (this was Table 5-7 in SPRS881).
..............
•
Global:
Changed “EPWMSYNCI” to “EXTSYNCIN”.
...........................................................................
•
Global:
Changed “EPWMSYNCO” to “EXTSYNCOUT”.
.......................................................................
•
Global:
Changed V
DDSFL
to V
DD3VFL
.
...............................................................................................
•
(Features): Updated section.
.........................................................................................
•
(Description): Updated paragraph about connectivity.
............................................................
•
(Functional Block Diagram): Changed CPU1.D0 RAM and CPU1.D1 RAM to secure memory.
.............
•
: Moved ADCIN14 and ADCIN15 to "Analog Mux".
.................................................................
•
: Changed "Watchdog 1/2" to "Watchdog".
..........................................................................
•
: Changed “EPWMSYNCI” to “EXTSYNCIN".
.......................................................................
•
: Changed “EPWMSYNCO” to “EXTSYNCOUT".
...................................................................
•
: Changed "GPIO MUX" to "GPIO MUX, Input X-BAR, Output X-BAR".
.........................................
•
(Device Comparison): ADC 12-bit mode: Changed "Channels (
differential/
single-ended)" to
"Channels (single-ended)". Updated number of channels.
...................................................................
•
: Changed "On-chip crystal oscillator/External clock input" to "Crystal oscillator/External clock input".
.....
•
: Updated SDFM channels for 100-Pin PZP package.
.............................................................
•
: Updated temperature ranges (see
Global
changes).
............................................................
•
: Removed Product status information and footnote.
...............................................................
•
: Added footnote about sample-and-hold window.
..................................................................
•
: Added footnote about peripheral count on smaller package.
....................................................
•
: Added footnote about CAN.
..........................................................................................
•
: Restructured table.
....................................................................................................
•
(Pin Diagrams): Added section title.
...............................................................................
•
: Added NOTE about PCB footprints and schematic symbols.
.................................................
•
(100-Pin PZP PowerPAD HTQFP (Top View)): Pin 17: Changed name from V
SSA
to V
SSA
/V
REFLOA
.......
•
(Signal Descriptions): Updated DESCRIPTION of V
REFHIA
, V
REFHIB
, V
REFHIC
, V
REFHID
, ADCINA0,
ADCINA1, ADCINB0, VDAC, ADCINB1, GPIO41, XCLKOUT, XRS, TDO, V
DD
, and V
DDOSC
.
...........................
•
(Pins With Internal Pullup and Pulldown): Added section.
......................................................
•
(Input X-BAR): Added section.
...................................................................................
•
(Output X-BAR): Added section.
.................................................................................
•
(Alternate USB Function): Changed GPBAMSEL SETTING value from "1" to "1b".
..........................
•
(High-Speed SPI Pin Muxing): Added section.
................................................................
•
: Changed "MUX CONFIGURATION" value from "0x11" to "11b".
...............................................
•
(Absolute Maximum Ratings): Reformatted table.
...............................................................
•
: Changed "Output clamp current, I
OK
" to "Output current, I
OUT
"
................................................
•
: Added Operating junction temperature, T
J
.......................................................................
•
: Added Storage temperature, T
stg
..................................................................................
•
(ESD Ratings): Changed section title from "Handling Ratings" to "ESD Ratings".
..........................
•
: Updated section.
.....................................................................................................
•
(Recommended Operating Conditions): Updated temperature ranges (see
Global
changes).
............
•
: Updated "V
DDIO
, V
DD3VFL
, V
DDOSC
, and V
DDA
..." footnote.
.......................................................
•
: Added "Operation above T
J
= 105°C for extended duration will reduce the lifetime of the device ..."
footnote.
.............................................................................................................................
6
Revision History
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: