ADV
ANCEINFORMA
TION
PREFIX
TMS
TMX = experimental device
TMP = prototype device
TMS = qualified device
320
DEVICE FAMILY
320 = TMS320 MCU Family
F
TECHNOLOGY
F = Flash
28377S
DEVICE
28377S
28376S
28375S
28374S
PTP
PACKAGE TYPE
176
337-Ball ZWT New Fine Pitch Ball Grid Array (nFBGA)
-Pin PTP PowerPAD Thermally Enhanced Low-Profile Quad Flatpack (HLQFP)
100-Pin PZP PowerPAD Thermally Enhanced Thin Quad Flatpack (HTQFP)
TEMPERATURE RANGE
S
−40°C to 105°C (T )
−40°C to 125°C (T )
−40°C to 125°C (T )
(Q refers to Q100 qualification for automotive applications.)
J
J
A
T
S
Q
=
=
=
TMS320F28377S, TMS320F28376S, TMS320F28375S, TMS320F28374S
SPRS881A – AUGUST 2014 – REVISED JUNE 2015
Figure 7-1. Device Nomenclature
Copyright © 2014–2015, Texas Instruments Incorporated
Device and Documentation Support
187
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