ADV
ANCEINFORMA
TION
TMS320F28377S, TMS320F28376S, TMS320F28375S, TMS320F28374S
SPRS881A – AUGUST 2014 – REVISED JUNE 2015
•
: Added reference to the
Calculating Useful Lifetimes of Embedded Processors Application Report
(SPRABX4).
.........................................................................................................................
•
(Electrical Characteristics): Updated V
OH
, V
OL
, I
OH
, I
OL
, I
OZ
, V
IH
, V
IL
, I
IH
, and I
IL
..............................
•
(Power Consumption Summary): Added section.
................................................................
•
(Operational Current Consumption Graphs): Added section.
................................................
•
(Thermal Resistance Characteristics): Added section.
..........................................................
•
(ZWT Package): Added section.
.................................................................................
•
(PTP Package): Added section.
..................................................................................
•
(PZP Package): Added section.
..................................................................................
•
(System): Changed section title from "Timing and Switching Characteristics" to "System".
...............
•
(Power Sequencing): Changed section title from "Power Management" to "Power Sequencing".
......
•
: Updated and restructured section.
..............................................................................
•
(Reset Timing): Added section.
..................................................................................
•
(Clock Specifications): Changed section title from "Clocking" to "Clock Specifications".
................
•
(Clock Sources): Removed "Clocking Options for System PLL" figure (which was Figure 5-1 in
SPRS881).
..........................................................................................................................
•
: Removed NOTE about clock name, PERx.SYSCLK.
......................................................
•
: Removed "Clocking Options for Auxiliary PLL" figure (which was Figure 5-2 in SPRS881).
.........
•
: Removed "Peripheral Clock Options" figure (which was Figure 5-3 in SPRS881).
....................
•
(Device Clocking): Added figure.
....................................................................................
•
(Input Clock Frequency): Changed MIN value of f
(OSC)
from 2 MHz to 10 MHz.
...............................
•
(X1 Input Level Characteristics When Using an External Clock Source (Not a Crystal)): Added table.
....
•
(PLL Lock Times): Updated table and footnote.
..................................................................
•
(Internal Clock Frequencies): Added t
c(SYSCLK)
....................................................................
•
: Added f
(PLLRAWCLK)
....................................................................................................
•
: Added f
(AUXPLLRAWCLK)
................................................................................................
•
: Added t
c(LSPCLK)
.......................................................................................................
•
: Added f
(HRPWM)
........................................................................................................
•
: Removed NOM value of f
(LSP)
, 50 MHz.
...........................................................................
•
: Combined LSPCLK footnote and default-at-reset footnote.
....................................................
•
(Connecting Input Clocks to a 2837xS Device): Updated figure.
...............................................
•
(Crystal Oscillator): Added section.
...........................................................................
•
(Crystal Oscillator Parameters): Added table.
....................................................................
•
(Crystal Equivalent Series Resistance (ESR) Requirements): Changed "MAXIMUM ESR (
Ω
) (
CL1/2
= 12 pF)" to "MAXIMUM ESR (
Ω
) (CL1 = CL2 = 12 pF)"
......................................................................
•
: Changed "MAXIMUM ESR (
Ω
) (
CL1/2
= 24 pF)" to "MAXIMUM ESR (
Ω
) (CL1 = CL2 = 24 pF)"
.........
•
: Removed data for CRYSTAL FREQUENCY of 2 MHz, 4 MHz, 6 MHz, and 8 MHz.
.......................
•
(Crystal Oscillator Electrical Characteristics): Added table.
.....................................................
•
(Internal Oscillator Electrical Characteristics): Frequency accuracy across temperature: Removed
temperature ranges from TEST CONDITIONS.
................................................................................
•
: Added t
OSCST
symbol to "Start-up and settling time".
............................................................
•
(Flash Parameters): Changed section title from "Flash Timing" to "Flash Parameters"
...................
•
(Flash Parameters at 200 MHz): Added table.
....................................................................
•
(Flash/OTP Endurance): Added table.
.............................................................................
•
(Flash Data Retention Duration): Added table.
...................................................................
•
(Emulation/JTAG): Added section.
..............................................................................
•
(GPIO Electrical Data and Timing): Added section.
...........................................................
•
(External and ePIE Interrupt Sources): Updated figure.
........................................................
•
(External Interrupt Electrical Data and Timing): Added section.
...........................................
•
(Low-Power Mode Wakeup Timing): Added section.
.......................................................
•
(External Memory Interface): Updated section.
................................................................
•
(Synchronous DRAM Support): Updated section.
...........................................................
•
(EMIF Electrical Data and Timing): Added section.
.........................................................
•
(Analog Peripherals): Changed "each containing a 12-bit reference DAC" to "each containing two
12-bit reference DACs".
...........................................................................................................
•
(Analog Subsystem Block Diagram (337-Ball ZWT)): Updated figure.
.......................................
•
(Analog Subsystem Block Diagram (176-Pin PTP)): Updated figure.
.........................................
•
(Analog Subsystem Block Diagram (100-Pin PZP)): Updated figure.
.........................................
•
(Analog-to-Digital Converter (ADC)): Updated "The ADCs on this device are successive
approximation (SAR) style ADCs ..." paragraph.
...............................................................................
Copyright © 2014–2015, Texas Instruments Incorporated
Revision History
7
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