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[3] Copying .................................................................................................................................... 3-34
[4] Initialize the measurement conditions for each type ................................................................ 3-35
[5] NG image registration (IV-S32M/S33M) .................................................................................. 3-36
[6] Halt on NG measurement ........................................................................................................ 3-37
[7] Window group move ................................................................................................................ 3-38
Chapter 4: Positional Deviation Measurement .............................................. 4-1 to 4-8
Chapter 5: Degree of Match Inspection ......................................................... 5-1 to 5-4
Chapter 6: Lead Inspection ............................................................................. 6-1 to 6-4
Chapter 7: BGA/CSP Inspection ..................................................................... 7-1 to 7-6
Chapter 8: Area Measurement by Binary Conversion .................................. 8-1 to 8-7
Chapter 9: Object Counting by Binary Conversion ...................................... 9-1 to 9-5
Chapter 10: Object Identification by Binary Conversion .......................... 10-1 to 10-5
Chapter 11: Existence Inspection by Point Measurement ....................... 11-1 to 11-5
Chapter 12: Multiple positional measurements ........................................ 12-1 to 12-6
Chapter 13: Multiple degree of match inspection ...................................... 13-1 to13-4
Chapter 14: Distance and Angle Measurement ......................................... 14-1 to 14-6
Chapter 15 Numerical Calculations .......................................................... 15-1 to 15-16
15-1 The individual numerical calculations for each measuring program ........................................ 15-2
[1] The setting details .................................................................................................................... 15-2
[2] Types and number of styles of entered for each measurement program ................................ 15-4
[3] Display lists on the [NUMERICA CALC] menu ........................................................................ 15-6
15-2 Final numerical calculations ................................................................................................... 15-10
15-3 Setting examples ................................................................................................................... 15-12
Chapter 16: PC Function ........................................................................... 16-1 to 16-19
16-1 Operation cycle ........................................................................................................................ 16-1
[1] Power ON sequence ................................................................................................................ 16-2
[2] PC scan cycle .......................................................................................................................... 16-2
(1) Input refresh ....................................................................................................................... 16-2
(2) Ladder circuit calculation (final output conditions) .............................................................. 16-2
(3) Output refresh .................................................................................................................... 16-2
[3] Measurement processing cycle ............................................................................................... 16-2
(1) Measurement processing (measurement 0 to 4) ................................................................ 16-2
(2) Ladder circuit calculation (based on output conditions for measurements 0 to 4) ............. 16-2
16-2 Ladder circuit program creation .............................................................................................. 16-3
[1] Procedure for creating measurement output condition and a ladder circuit ............................. 16-3
[2] Procedure for creating the final output conditions in a ladder circuit ...................................... 16-11
16-3 Program examples (shape and positional deviation inspection) ........................................... 16-17
16-4 Examples of a final output conditions ladder circuit .............................................................. 16-18