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Rockwell Automation Publication 2094-UM001D-EN-P - May 2010
33
Planning the Kinetix 6000 Drive System Installation
Chapter
2
Bonding Multiple Subpanels
Bonding multiple subpanels creates a common low impedance exit path for the
high frequency energy inside the cabinet. Subpanels that are not bonded together
may not share a common low impedance path. This difference in impedance may
affect networks and other devices that span multiple panels.
•
Bond the top and bottom of each subpanel to the cabinet by using
25.4 mm (1.0 in.) by 6.35 mm (0.25 in.) wire braid. As a rule, the wider
and shorter the braid is, the better the bond.
•
Scrape the paint from around each fastener to maximize metal-to-metal
contact.
Figure 8 - Multiple Subpanels and Cabinet Recommendations
Wire Braid
25.4 mm (1.0 in.) by
6.35 mm (0.25 in.)
Paint removed
from cabinet.
Cabinet ground bus
bonded to the subpanel.
Wire Braid
25.4 mm (1.0 in.) by
6.35 mm (0.25 in.)
Содержание Allen-Bradley 2094-BC01-M01-S
Страница 4: ...4 Rockwell Automation Publication 2094 UM001D EN P May 2010 Summary of Changes Notes...
Страница 10: ...10 Rockwell Automation Publication 2094 UM001D EN P May 2010 Table of Contents Notes...
Страница 126: ...126 Rockwell Automation Publication 2094 UM001D EN P May 2010 Chapter 5 Connecting the Kinetix 6000 Drive System Notes...
Страница 228: ...228 Rockwell Automation Publication 2094 UM001D EN P May 2010 Appendix B Interconnect Diagrams Notes...
Страница 270: ...270 Rockwell Automation Publication 2094 UM001D EN P May 2010 Appendix F RBM Module Interconnect Diagrams Notes...
Страница 278: ...278 Rockwell Automation Publication 2094 UM001D EN P May 2010 Index Notes...
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