UM10462
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© NXP B.V. 2016. All rights reserved.
User manual
Rev. 5.5 — 21 December 2016
8 of 523
NXP Semiconductors
UM10462
Chapter 1: LPC11U3x/2x/1x Introductory information
–
12 MHz Internal high-frequency RC oscillator (IRC) that can optionally be used as
a system clock.
–
Internal low-power, low-frequency WatchDog Oscillator (WDO) with programmable
frequency output.
–
PLL allows CPU operation up to the maximum CPU rate with the system oscillator
or the IRC as clock sources.
–
A second, dedicated PLL is provided for USB.
–
Clock output function with divider that can reflect the crystal oscillator, the main
clock, the IRC, or the watchdog oscillator.
•
Power control:
–
Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep
power-down.
–
Power profiles residing in boot ROM allow optimized performance and minimized
power consumption for any given application through one simple function call.
–
Processor wake-up from Deep-sleep and Power-down modes via reset, selectable
GPIO pins, watchdog interrupt, BOD interrupt, or USB port activity.
–
Processor wake-up from Deep power-down mode using one special function pin.
–
Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, Power-down, and Deep power-down modes.
–
Power-On Reset (POR).
–
Brownout detect with four separate thresholds for interrupt and forced reset.
•
Unique device serial number for identification.
•
Single 3.3 V power supply (1.8 V to 3.6 V).
•
Temperature range
40
C to +85
C.
•
Available as LQFP64, LQFP48, TFBGA48 packages, and as HVQFN33 in two
package sizes: 5 x 5 x 0.85 mm and 7 x 7 x 0.85 mm.
•
Pin-compatible to the ARM Cortex-M3 based LPC134x series.
1.3 Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC11U12FHN33/201
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7
7
0.85 mm
n/a
LPC11U12FBD48/201
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
LPC11U13FBD48/201
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
LPC11U14FHN33/201
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7
7
0.85 mm
n/a
LPC11U14FHI33/201
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5
5
0.85 mm
n/a
LPC11U14FBD48/201
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
LPC11U14FET48/201
TFBGA48
plastic thin fine-pitch ball grid array package; 48 balls; body 4.5
4.5
0.7 mm
SOT1155-2