User’s Manual U17446EJ3V1UD
365
CHAPTER 24 RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Cautions 1. Products with -A at the end of the part number are lead-free products.
2. For soldering methods and conditions other than those recommended below, contact an NEC
Electronics sales representative.
Table 24-1. Surface Mounting Type Soldering Conditions (1/2)
30-pin plastic SSOP
μ
PD78F9232MC-5A4, 78F9234MC-5A4, 78F9232MC(A)-5A4
Note 1
, 78F9234MC(A)-5A4
Note 1
,
μ
PD78F9232MC(A2)-5A4
Note 1
, 78F9234MC(A2)-5A4
Note 1
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: 3 times or less, Exposure limit: 7 days
Note 2
(after that, prebake at 125
°
C for
20 to 72 hours)
IR35-207-3
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: 3 times or less, Exposure limit: 7 days
Note 2
(after that, prebake at 125
°
C for
20 to 72 hours)
VP15-207-3
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C max. (package surface temperature), Exposure
limit: 7 days
Note 2
(after that, prebake at 125
°
C for 20 to 72 hours)
WS60-207-1
Partial heating
Pin temperature: 350
°
C max., Time: 3 seconds max. (per pin row)
−
Notes 1.
Under development
2.
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
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Содержание 78K0S/KB1+
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