E
2-1
8/26/97 10:42 AM CH02.DOC
INTEL CONFIDENTIAL
(until publication date)
CHAPTER 2
MICRO-ARCHITECTURE OVERVIEW
The Pentium II processor uses the same dynamic execution micro-architecture as the other
members of P6 family of Intel Architecture processors. This three-way superscalar, pipelined
micro-architecture features a decoupled, multi-stage superpipeline, which trades less work
per pipestage for more stages. The Pentium II processor, for example, has twelve stages with
a pipestage time 33 percent less than the Pentium processor, which helps achieve a higher
clock rate on any given manufacturing process.
The approach used in the P6 family micro-architecture removes the constraint of linear
instruction sequencing between the traditional “fetch” and “execute” phases, and opens up a
wide instruction window using an instruction pool. This approach allows the “execute” phase
of the processor to have much more visibility into the program instruction stream so that
better scheduling may take place. It requires the instruction “fetch/decode” phase of the
processor to be much more efficient in terms of predicting program flow. Optimized
scheduling requires the fundamental “execute” phase to be replaced by decoupled
“dispatch/execute” and “retire” phases. This allows instructions to be started in any order but
always be completed in the original program order. Processors in the P6 family may be
thought of as three independent engines coupled with an instruction pool as shown in
Figure 2-1.
Fetch/
Decode
Unit
Dispatch/
Execute
Unit
Retire
Unit
Instruction Pool
000925
Figure 2-1. Three Engines Communicating Using an Instruction Pool
Содержание Pentium II
Страница 1: ...D Pentium II Processor Developer s Manual 243502 001 October 1997 1997...
Страница 11: ...E 1 Component Introduction...
Страница 12: ......
Страница 17: ...E 2 Micro Architecture Overview...
Страница 18: ......
Страница 33: ...E 3 System Bus Overview...
Страница 34: ......
Страница 45: ...E 4 Data Integrity...
Страница 46: ......
Страница 51: ...E 5 Configuration...
Страница 52: ......
Страница 62: ......
Страница 63: ...E 6 Test Access Port TAP...
Страница 64: ......
Страница 75: ...E 7 Electrical Specifications...
Страница 76: ......
Страница 106: ......
Страница 107: ...E 8 GTL Interface Specifications...
Страница 108: ......
Страница 129: ...E 9 Signal Quality Specifications...
Страница 130: ......
Страница 136: ......
Страница 137: ...E 10 Thermal Specifications and Design Considerations...
Страница 138: ......
Страница 149: ...E 11 S E C Cartridge Mechanical Specifications...
Страница 150: ......
Страница 154: ...S E C CARTRIDGE MECHANICAL SPECIFICATIONS E 11 4 001055a Figure 11 2 S E C Cartridge Top and Side Views...
Страница 155: ...E S E C CARTRIDGE MECHANICAL SPECIFICATIONS 11 5 001054a Figure 11 3 S E C Cartridge Bottom Side View...
Страница 173: ...E 12 Boxed Processor Specifications...
Страница 174: ......
Страница 185: ...E 13 Integration Tools...
Страница 186: ......
Страница 202: ......
Страница 203: ...E 14 Advanced Features...
Страница 204: ......
Страница 206: ......
Страница 207: ...E A Signals Reference...
Страница 208: ......