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COMPONENT INTRODUCTION

1-3

8/26/97 10:33 AM CH01.DOC

INTEL CONFIDENTIAL

(until publication date)

1.2.1.

S.E.C. Cartridge Terminology

The following terms are used often in this document and are explained here for clarification:

•

Pentium

II Processor — The entire product including internal components, substrate,

thermal plate and cover.

•

S.E.C. Cartridge — The new processor packaging technology is called a “Single Edge
Contact cartridge.”

•

Processor Substrate —The structure on which the components are mounted inside the
S.E.C. cartridge (with or without components attached).

•

Processor Core — The processor’s execution engine.

•

Thermal Plate — The surface used to connect a heatsink or other thermal solutions to
the processor.

•

Cover — The processor casing on the opposite side of the thermal plate.

•

Latch Arms — A processor feature that can be utilized as a means for securing the
processor in the retention mechanism.

Additional terms referred to in this and other related documentation:

•

Slot 1 — The connector that the S.E.C. cartridge plugs into, just as the Pentium

Pro

processor uses Socket 8.

•

Retention Mechanism — A mechanical piece which holds the package in the Slot 1
connector.

•

Heatsink Support — The support pieces that are mounted on the motherboard to
provide added support for heatsinks.

The L2 cache (TagRAM, BSRAM) dies keep standard industry names.

1.3.

REFERENCES

The reader of this specification should also be familiar with material and concepts presented
in the following documents:

•

AP-485, Intel Processor Identification with the CPUID Instruction (Order Number
241618)

•

AP-585, Pentium

II Processor GTL+ Guidelines (Order Number 243330)

•

AP-586, Pentium

II Processor Thermal Design Guidelines (Order Number 243331)

•

AP-587, Pentium

II Processor Power Distribution Guidelines (Order Number 243332)

•

AP-588, Mechanical and Assembly Technology for S.E.C. Cartridge Processors (Order
Number 243333)

•

AP-589, Pentium

II Processor Electro-Magnetic Interference (Order Number 243334)

Содержание Pentium II

Страница 1: ...D Pentium II Processor Developer s Manual 243502 001 October 1997 1997...

Страница 2: ...rs must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever f...

Страница 3: ...Pipeline 2 9 2 3 2 Caches 2 13 2 4 WRITE BUFFERS 2 14 2 5 ADDITIONAL INFORMATION 2 14 2 6 ARCHITECTURE SUMMARY 2 14 CHAPTER 3 SYSTEM BUS OVERVIEW 3 1 SIGNALING ON THE PENTIUM II PROCESSOR SYSTEM BUS...

Страница 4: ...5 4 5 1 11 BINIT Observation Policy 5 4 5 1 12 In Order Queue Pipelining 5 4 5 1 13 Power On Reset Vector 5 4 5 1 14 FRC Mode Enable 5 4 5 1 15 APIC Mode 5 5 5 1 16 APIC Cluster ID 5 5 5 1 17 Symmetr...

Страница 5: ...II PROCESSOR SYSTEM BUS AC SPECIFICATIONS 7 19 CHAPTER 8 GTL INTERFACE SPECIFICATIONS 8 1 SYSTEM SPECIFICATION 8 1 8 1 1 System Bus Specifications 8 2 8 1 2 System AC Parameters Signal Quality 8 3 8 1...

Страница 6: ...2 Boxed Processor Fan Heatsink Weight 12 4 12 2 3 Boxed Processor Retention Mechanism and Fan Heatsink Support 12 4 12 3 BOXED PROCESSOR REQUIREMENTS 12 8 12 3 1 Fan Heatsink Power Supply 12 8 12 4 T...

Страница 7: ...6 6 7 1 GTL Bus Topology 7 1 7 2 Stop Clock State Machine 7 2 7 3 Timing Diagram of Clock Ratio Signals 7 7 7 4 Example Schematic for Clock Ratio Pin Sharing 7 8 7 5 BCLK to Core Logic Offset 7 25 7...

Страница 8: ...rmal Plate Detail Dimensions 11 9 11 9 S E C Cartridge Substrate Dimensions Skirt not shown for clarity 11 10 11 10 S E C Cartridge Substrate Dimensions Cover Side View 11 10 11 11 S E C Cartridge Sub...

Страница 9: ...equency to Core Frequency Ratio Bit Field 5 8 6 1 1149 1 Instructions in the Processor TAP 6 7 6 2 TAP Data Registers 6 8 6 3 Device ID Register 6 9 6 4 TAP Reset Actions 6 9 7 1 Core Frequency to Sys...

Страница 10: ...3 Signal Listing in Order by Pin Number 11 13 11 4 Signal Listing in Order by Signal Name 11 18 12 1 Boxed Processor Fan Heatsink Spatial Dimensions 12 4 12 2 Boxed Processor Fan Heatsink Support Dime...

Страница 11: ...E 1 Component Introduction...

Страница 12: ......

Страница 13: ...significant headroom for business desktop systems The Pentium II processor system bus operates in the same manner as the Pentium Pro processor system bus The Pentium II processor system bus uses GTL s...

Страница 14: ...level For example when FLUSH is low a flush has been requested When NMI is high a non maskable interrupt has occurred In the case of signals where the name does not imply an active state but describes...

Страница 15: ...l terms referred to in this and other related documentation Slot 1 The connector that the S E C cartridge plugs into just as the Pentium Pro processor uses Socket 8 Retention Mechanism A mechanical pi...

Страница 16: ...r 243337 Pentium II Processor I O Buffer Models IBIS Format Electronic Form Intel Architecture Software Developer s Manual Volume I Basic Architecture Order Number 243190 Volume II Instruction Set Ref...

Страница 17: ...E 2 Micro Architecture Overview...

Страница 18: ......

Страница 19: ...ch and execute phases and opens up a wide instruction window using an instruction pool This approach allows the execute phase of the processor to have much more visibility into the program instruction...

Страница 20: ...ead stored back in the instruction pool awaiting in order retirement The core executes instructions depending upon their readiness to execute and not on their original program order and is therefore a...

Страница 21: ...ad Store Fetch Decode Unit Dispatch Execute Unit Retire Unit 000926 Figure 2 3 The Three Core Engines Interface with Memory via Unified Caches The FETCH DECODE unit An in order unit that takes as inpu...

Страница 22: ...Branch Target Buffer Register Alias Table Allocate 000927 Figure 2 4 Inside the Fetch Decode Unit The L1 Instruction Cache is a local instruction cache The Next_IP unit provides the L1 Instruction Cac...

Страница 23: ...n array of Content Addressable Memory called the ReOrder Buffer ROB 2 2 2 The Dispatch Execute Unit The Dispatch unit selects ops from the instruction pool depending upon their status If the status in...

Страница 24: ...correctly predict most of these branches but it can t correctly predict them all Consider a BTB that is correctly predicting the backward branch at the bottom of a loop eventually that loop is going...

Страница 25: ...instruction The Retire Unit must not only notice which ops are complete it must also re impose the original program order on them It must also do this in the face of interrupts traps faults breakpoint...

Страница 26: ...plete Stores are never performed speculatively since there is no transparent way to undo them Stores are also never re ordered among themselves A store is dispatched only when both the address and the...

Страница 27: ...line The data cache is pseudo dual ported via interleaving with one port dedicated to loads and the other to stores Most simple operations integer ALU floating point add even floating point multiply c...

Страница 28: ...ID1 Decode 1 stage decoder limits at most 3 macro instructions per cycle at most 6 ops 411 per cycle at most 3 ops per cycle exit the queue instructions 7 bytes in length RAT Register Allocation Deco...

Страница 29: ...ry form have two to three ops Simple read modify write instructions are four ops Complex instructions generally have more than four ops therefore they will take multiple cycles to decode For the purpo...

Страница 30: ...multiple pipelines grouped into five clusters Re order Buffer Writeback ROB wb Retirement RRF At most three ops are retired per cycle Taken branches must retire in the first slot Reservation station...

Страница 31: ...e 3 3 4 Store Data Unit Latency 1 N A Throughput 1 cycle NOTES 1 The FMUL unit cannot accept a second FMUL within the cycle after it has accepted the first This is NOT the same as only being able to d...

Страница 32: ...to each pipe in Pentium processors without MMX technology Performance of critical loops can be improved by scheduling the writes to memory when you expect to see write misses you should schedule the...

Страница 33: ...E 3 System Bus Overview...

Страница 34: ......

Страница 35: ...input paths between the buffer and the latch stage thus keeping setup and hold times constant for all bus signals following the latched protocol The System bus requires that every input be sampled du...

Страница 36: ...s are grouped according to function 3 2 1 Execution Control Signals Table 3 1 lists the execution control signals which control the execution and initialization of the processor Table 3 1 Execution Co...

Страница 37: ...cution The assertion of STPCLK has no effect on the bus clock The SLP signal is the Sleep signal When asserted in Stop Grant state the processor enters a new low power state the Sleep state During Sle...

Страница 38: ...led active no symmetric agent issues another unlocked bus transaction until BPRI is sampled inactive The priority agent is always the next bus owner BNR can be asserted by any bus agent to block furth...

Страница 39: ...4 gigabits 64 GByte Address bits 2 1 and 0 are mapped into byte enable signals for 1 to 8 byte transfers The address signals are protected by the AP 1 0 pins AP1 covers A 35 24 AP0 covers A 23 3 AP 1...

Страница 40: ...e transaction from the In order Queue by generating the appropriate response 3 2 5 Response Signals The response signal group see Table 3 5 provides response information to the requesting agent Table...

Страница 41: ...lock data transfer DBSY need not be asserted for single clock data transfers if no wait states are needed The D 63 0 signals provide a 64 bit data path between bus agents The DEP 7 0 signals provide o...

Страница 42: ...the BINIT driver is disabled BINIT is never asserted and no action is taken on bus errors Regardless of whether the BINIT driver is enabled the Pentium II processor supports two modes of operation tha...

Страница 43: ...3 8 contains signals defined for compatibility within the Intel Architecture processor family Table 3 8 PC Compatibility Signals Type Signal Names Floating Point Error FERR Ignore Numeric Error IGNNE...

Страница 44: ...handler 3 2 9 Diagnostic Signals The BP 3 2 signals are the System Support group Breakpoint signals They are outputs from the processor that indicate the status of breakpoints The BPM 1 0 signals are...

Страница 45: ...E 4 Data Integrity...

Страница 46: ......

Страница 47: ...hitecture Several model specific registers are defined for reporting error status Hardware corrected errors are reported to registers associated with the unit reporting the error Unrecoverable errors...

Страница 48: ...g parity or ECC Eight ECC bits protect the data bus Single bit data ECC errors are automatically corrected A two bit parity code protects the address bus Any address parity error on the address bus wh...

Страница 49: ...r checking or with ECC If ECC is selected single bit errors can be corrected and double bit errors can be detected Corrected single bit ECC errors are logged as recoverable errors All other errors are...

Страница 50: ...e correct parity A correct parity signal is high if all covered signals are high or if an even number of covered signals are low A correct parity signal is low if an odd number of covered signals are...

Страница 51: ...E 5 Configuration...

Страница 52: ......

Страница 53: ...ctive transition of RESET and be deasserted two clocks after the active to inactive transition of RESET see Figure 5 1 The IGNNE A20M and LINT 1 0 signals must meet a setup time of 1 ms to the active...

Страница 54: ...rs enabled or disabled Software BINIT error driving policy enabled or disabled Software BINIT error observation policy enabled or disabled Hardware In order Queue depth 1 or 8 Hardware Power on reset...

Страница 55: ...s optional After active RESET address bus parity error driving is always disabled It may be enabled under software control 5 1 6 AERR Observation Policy The AERR input receiver is enabled if A8 is obs...

Страница 56: ...RESET The Pentium II processor requires BINIT observation to be enabled during normal operation 5 1 12 In Order Queue Pipelining Pentium II processor system bus agents are configured to an In order Qu...

Страница 57: ...esignate electrical levels 5 1 17 Symmetric Agent Arbitration ID The Pentium II processor system bus supports symmetric distributed arbitration among one to two agents Each processor identifies its in...

Страница 58: ...tration ID L H H 0 H H H 1 L H L 0 master H H L 0 checker NOTE 1 L and H designate electrical levels 5 1 18 Low Power Standby Enable A configuration register bit which enables distribution of the core...

Страница 59: ...Processor Active Signals Processor Register Bits Read Write Default Output tristate enabled FLUSH D8 1 Read N A Execute BIST INIT D9 1 Read N A Data error checking enabled N A D1 1 Read Write Disabled...

Страница 60: ...Write Enabled Table 5 5 Pentium II Processor Family Power On Configuration Register APIC Cluster ID Bit Field APIC ID D 17 16 0 00 1 01 2 10 3 11 Table 5 6 Pentium II Processor Family Power On Config...

Страница 61: ...F0 During initialization each processor begins active BNR sequencing from the RESET signal s active to inactive transition until it is able to accept though not necessarily issue bus transactions Sign...

Страница 62: ......

Страница 63: ...E 6 Test Access Port TAP...

Страница 64: ......

Страница 65: ...n decode logic and data registers The set of data registers includes those described in the 1149 1 standard the bypass register device ID register BIST result register and boundary scan register 6 1 I...

Страница 66: ...essed through a 1149 1 compliant TAP controller finite state machine This finite state machine shown in Figure 6 2 contains a reset state a run test idle state and two major branches These branches al...

Страница 67: ...tely when TRST is pulled active and automatically upon power up of the processor The TAP controller cannot leave this state as long as TRST is held active Run Test Idle This is the idle state of the T...

Страница 68: ...n the falling edge of TCK The parallel latched output of the selected Data Register does not change while new data is being shifted in Exit1 DR This is a temporary state All registers retain their pre...

Страница 69: ...path between TDI and TDO In Update IR the shift register contents are latched in parallel into the actual instruction register Note that the only time the outputs of the actual instruction register c...

Страница 70: ...ay as the instruction register with components i e either the capture or update functionality removed from the basic structure as needed Data registers are accessed just as the instruction register is...

Страница 71: ...ter HIGHZ 001000 Floated Bypass Reset bypass reg Shift data register BYPASS 111111 Bypass Reset bypass reg Shift data register Reserved All other Reserved Reserved Reserved Reserved Reserved Reserved...

Страница 72: ...a registers which can be accessed through the TAP The MSB of the register is connected to TDI for writing and the LSB of the register is connected to TDO for reading when that register is selected Tab...

Страница 73: ...be driven low during TAP operation For more information on Boundary Scan refer to the Pentium II Processor Boundary Scan Description Language files at the Intel developer s website at developer intel...

Страница 74: ...on the processor This automatically asynchronously resets the TAP controller Assert the TRST pin at any time This asynchronously resets the TAP controller Hold the TMS pin high for 5 consecutive cycl...

Страница 75: ...E 7 Electrical Specifications...

Страница 76: ......

Страница 77: ...ace is used to pull the bus up to the high voltage level and to control reflections on the transmission line VREF is used by the receivers to determine if a signal is a logical 0 or a logical 1 and is...

Страница 78: ...erted 3 Stop Grant State BCLK running Snoops and interrupts allowed SLP Asserted SLP De asserted 5 Sleep State BCLK running No snoops or interrupts allowed BCLK Input Stopped BCLK Input Restarted 6 De...

Страница 79: ...ssor will return to the AutoHALT state The system can generate a STPCLK while the processor is in the AutoHALT Power Down state When the system deasserts the STPCLK interrupt the processor will return...

Страница 80: ...essor to enter the Sleep state The SLP pin is not recognized in the Normal or AutoHALT states Snoop events that occur while in Sleep state or during a transition into or out of Sleep state will cause...

Страница 81: ...cache during AutoHALT Power Down or Stop Grant states Entrance into the HALT Grant Snoop state will allow the L2 cache to be snooped similar to Normal state When the processor is in Sleep and Deep Sle...

Страница 82: ...a reduced lifetime of the component 7 4 1 Pentium II Processor VccCORE Decoupling Regulator solutions need to provide bulk capacitance with a low Effective Series Resistance ESR This can be accomplis...

Страница 83: ...uency LINT 1 LINT 0 A20M IGNNE 1 2 2 L L L L 1 4 L L H L 2 7 L H L H 2 9 L H H L 1 2 2 H H H H NOTES 1 L and H designate electrical levels 2 This combination exists for safe power on only The processo...

Страница 84: ...V 000918 Figure 7 4 Example Schematic for Clock Ratio Pin Sharing If the multiplexer were powered by Vcc2 5 a pull down could be used on CRESET instead of the four pull up resistors between the multip...

Страница 85: ...frequency multipliers to each processor the design shown in Figure 7 4 would require two multiplexers 7 6 VOLTAGE IDENTIFICATION There are five voltage identification pins on the Pentium II processor...

Страница 86: ...05 4 1 1 1 1 1 No Core 1 1 1 1 0 2 1 4 1 1 1 0 1 2 2 4 1 1 1 0 0 2 3 4 1 1 0 1 1 2 4 4 1 1 0 1 0 2 5 4 1 1 0 0 1 2 6 4 1 1 0 0 0 2 7 4 1 0 1 1 1 2 8 4 1 0 1 1 0 2 9 1 0 1 0 1 3 0 1 0 1 0 0 3 1 1 0 0 1...

Страница 87: ...o VccCORE VccL2 VSS or to any signal can result in component malfunction or incompatibility with future Slot 1 products See Section 5 2 for a pin listing of the processor and the location of each Rese...

Страница 88: ...term GTL Input refers to the GTL input group as well as the GTL I O group when receiving Similarly GTL Output refers to the GTL output group as well as the GTL I O group when driving The CMOS Clock AP...

Страница 89: ...er the agent ID is determined See Appendix A for more information 2 See Section A 1 35 for information on the PWRGOOD signal 3 See Section 7 2 5 and Section A 1 42 for information on the SLP signal 4...

Страница 90: ...nctional operation at the absolute maximum and minimum is not implied nor guaranteed The processor should not receive a clock while subjected to these conditions Functional operating conditions are gi...

Страница 91: ...e See Table 7 6 2 This rating applies to the VccCORE VccL2 Vcc5 and any input except as noted below to the processor 3 Parameter applies to CMOS APIC and TAP bus signal groups only 4 The mechanical in...

Страница 92: ...level 0 185 0 185 V 6 IccCORE ICC for VccCORE 233 MHz 266 MHz 300 MHz 6 90 7 80 8 70 11 80 12 70 14 20 A A A 2 7 8 16 2 7 8 16 2 7 8 16 IccL2 ICC for L2 cache 0 50 1 40 A 3 8 Ivtt Termination voltage...

Страница 93: ...erating system These numbers are meant as a guideline only not a guaranteed specification Actual measurements will vary based upon system environmental conditions and configuration 8 Max ICC measureme...

Страница 94: ...t 15 A 3 NOTES 1 Parameter measured into a 50 resistor to 1 5V 2 0 VIN 2 5V 5 3 0 VOUT 2 5V 5 Table 7 8 Non GTL Signal Groups DC Specifications Symbol Parameter Min Max Unit Notes VIL Input Low Voltag...

Страница 95: ...cache bus frequencies Table 7 11 contains the GTL specifications Table 7 12 contains the CMOS signal group specifications Table 7 13 contains timings for the reset conditions Table 7 14 covers APIC bu...

Страница 96: ...during initialization as described in Section 7 5 Table 7 10 shows the supported ratios for each processor 4 The BCLK period allows a 0 5 ns tolerance for clock driver variation 5 The BCLK offset tim...

Страница 97: ...Figure Notes T7 GTL Output Valid Delay 1 07 6 37 ns 7 7 3 T8 GTL Input Setup Time 2 53 ns 7 8 4 5 6 T9 GTL Input Hold Time 1 53 ns 7 8 7 T10 RESET Pulse Width 1 00 ms 7 11 8 NOTES 1 Not 100 tested Spe...

Страница 98: ...ure recognition on a specific clock the setup and hold times with respect to BCLK must be met 6 INTR and NMI are only valid during APIC disable mode LINT 1 0 are only valid during APIC enabled mode 7...

Страница 99: ...D 1 0 Valid Delay 3 0 12 0 ns 7 7 4 5 6 NOTES 1 Not 100 tested Specified by design characterization 2 All AC timings for the APIC clock and APIC I O signals are referenced to the PICCLK rising edge at...

Страница 100: ...2 4 7 8 T44 Non Test Inputs Hold Time 14 5 ns 7 12 4 7 8 NOTES 1 All AC timings for the TAP signals are referenced to the TCK rising edge at 0 70V at the processor edge fingers All TAP signal timings...

Страница 101: ...receive the signal with a reference at 1 25V Timings for other components on the baseboard should use a BCLK reference voltage of 1 25V All GTL signal timings are referenced at 1 00V at the Slot 1 con...

Страница 102: ...0V for GTL signal group 1 25V for CMOS APIC and TAP signal groups Tpw 000762b Figure 7 7 System Bus Valid Delay Timings CLK Signal V Valid Ts T8 T12 T27 Setup Time Th T9 T13 T28 Hold Time V 1 0V for...

Страница 103: ...Input Setup Time Tv T10 RESET Pulse Width Tw T16 Reset Configuration Signals A 14 5 BR0 FLUSH INIT Setup Time Tx T17 Reset Configuration Signals A 14 5 BR0 FLUSH INIT Hold Time T20 Reset Configuratio...

Страница 104: ...uration A20M IGNNE LINT 1 0 000765b Ta Tb Tc Ta T15 PWRGOOD Inactive Pulse Width Tb T10 RESET Pulse Width Tc T20 Reset Configuration Signals A20M IGNNE LINT 1 0 Hold Time Valid Ratio V REF V CORE CC V...

Страница 105: ...etup Time Ts T44 All Non Test Inputs Hold Time Tu T40 TDO Float Delay Tv T37 TDI TMS Setup Time Tw T38 TDI TMS Hold Time Tx T39 TDO Valid Delay Ty T41 All Non Test Outputs Valid Delay Tz T42 All Non T...

Страница 106: ......

Страница 107: ...E 8 GTL Interface Specifications...

Страница 108: ......

Страница 109: ...pacitance and package stub length and a receiver threshold VREF that is proportional to the termination voltage The specification is given in two parts The first is the system specification which desc...

Страница 110: ...e placed electrically between the ends of the signal traces and the VTT voltage supply and generally are chosen to approximate the substrate impedance The valid high and low levels are determined by t...

Страница 111: ...s specified in Table 7 6 This is measured at the processor edge fingers It is recommended that VTT be held to 1 5 3 during system bus idle 3 VREF is generated by the processor to be 2 3 VTT nominally...

Страница 112: ...in 250mV of VREF at the processor edge fingers although specific devices may allow more ringing and loosen this specification See Section 8 1 2 1 for more details VREF 250 mV The overshoot undershoot...

Страница 113: ...to well controlled ringing into the overdrive zone or even to brief re crossing of the switching threshold VREF Such ringback tolerant receivers give the system designer more design freedom and if no...

Страница 114: ...given value of it is likely that will be the longest for the slowest input edge rate of 0 3V ns Furthermore there may be some dependence between and lower starting voltages than VREF 0 2V for Lo to Hi...

Страница 115: ...erate any ringback would show the following values for the above parameters 0V TSU 200 mV undefined 200 mV A receiver which tolerates 50 mV of ringback would show the following values for the above pa...

Страница 116: ...ent is similar for a simple Hi to Lo transition Notice that timing is measured at the driver and receiver pins while signal integrity is observed at the receiver chip pad When signal integrity at the...

Страница 117: ...Such a requirement would always yield signals with an average edge rate 0 3V ns but which could have instantaneous slopes that are lower or higher than 0 3V ns as long as they do not cause a crossing...

Страница 118: ...last crossing of VREF 200 mV using a line with a slope of 0 8V ns the maximum allowed rising edge rate This yields a new VREF crossing point to be used for the flight time calculation Figure 8 7 repr...

Страница 119: ...taken when using the 0 8V ns extrapolation The extrapolation is invalid whenever it yields a VREF crossing that occurs earlier than when the signal s actual edge crosses VREF In that case flight time...

Страница 120: ...adjustment factor that accounts for timing pushout seen when multiple bits change state at the same time The factors that contribute to the adjustment factor include crosstalk on the PCB substrate an...

Страница 121: ...DC parameters Table 8 3 I O Buffer DC Parameters Symbol Parameter Min Max Units Notes VOL Driver Output Low Voltage 0 600 V 1 VIH Receiver Input High Voltage VREF 0 2 V 2 VIL Receiver Input Low Voltag...

Страница 122: ...dge rate specifications 3 The minimum edge rate is a design target and slower edge rates can be acceptable although there is a timing impact associated with them in the form of an increase in flight t...

Страница 123: ...terconnect Clock NOTE This is specific to the Pentium processor Other GTL components may be specified to a different test load 000955 Figure 8 9 Test Load for Measuring Output AC Timings Driver Pin in...

Страница 124: ...IN_LOW_MAX VREF 200 mV and goes to VIN_HIGH_MIN VREF 200 mV at a slow edge rate of 0 3V ns with the process temperature voltage and VREF_INTERNAL of the receiver set to the worst longest TSU corner va...

Страница 125: ...ed when the input barely meets minimum setup time see definition of setup time above However for current GTL systems setup time is expected to be met well beyond the minimum required in cases where ho...

Страница 126: ...rate of 0 8V ns with the process temperature voltage and VREF_INTERNAL of the receiver set to the fastest or best corner values yielding the longest THOLD Here VREF is the external system reference v...

Страница 127: ...he Setup Time equation given earlier in Section 8 1 3 TFLIGHT_MAX Clock Period TCO MAX TSU MIN TCLK_SKEW MAX TCLK_JITTER MAX CLKADJ TADJ As an example for two identical agents located on opposite ends...

Страница 128: ...nd must be held at the receiver relative to the same clock edge THOLD TCO MIN TFLIGHT MIN TCLK SKEW MAX CLKADJ Assumptions TCO MIN 1 07 ns Assumed of max TCLK SKEW MAX 0 45 ns Driver to receiver skew...

Страница 129: ...E 9 Signal Quality Specifications...

Страница 130: ......

Страница 131: ...ameter Min Nom Max Unit Figure Notes V1 BCLK VIL 0 7 V 9 1 V2 BCLK VIH 1 8 V 9 1 V3 VIN Absolute Voltage Range 0 5 3 3 V 9 1 Overshoot Undershoot V4 Rising Edge Ringback 2 0 V 9 1 Absolute Value 1 V5...

Страница 132: ...SIGNAL QUALITY SPECIFICATIONS E 9 2 T3 V3 V5 V3 V2 V1 V7 V6 T6 T4 T5 V4 000808 Figure 9 1 BCLK TCK PICCLK Generic Clock Waveform at the Processor Edge Fingers...

Страница 133: ...3 1 Overshoot Undershoot Guidelines Overshoot or undershoot is the absolute value of the maximum voltage above the nominal high voltage or below VSS The overshoot undershoot guideline limits transitio...

Страница 134: ...eving its maximum absolute value See Figure 9 2 for an illustration of ringback Excessive ringback can cause false signal detection or extend the propagation delay The ringback specification applies t...

Страница 135: ...otal signal swing VHI VLO above and below its final value A signal should be within the settling limits of its final value when either in its high state or low state before it transitions again Signal...

Страница 136: ......

Страница 137: ...E 10 Thermal Specifications and Design Considerations...

Страница 138: ......

Страница 139: ...ble 10 1 provides the thermal design power dissipation for the Pentium II processor While the processor core dissipates the majority of the thermal power the thermal power dissipated by the L2 cache a...

Страница 140: ...The heatsink should be designed to dissipate the thermal plate power See Table 10 1 for Pentium II processor thermal design specifications 10 2 PENTIUM II PROCESSOR THERMAL ANALYSIS 10 2 1 Thermal Sol...

Страница 141: ...e Pentium II processor operation the thermal plate temperature TPLATE must be maintained at or below the maximum TPLATE temperature and at or above the minimum TPLATE temperature specified in Table 10...

Страница 142: ...089 Measure from edge of thermal plate Cover Measure T at this point PLATE Processor Core Substrate All dimensions in inches 0 35 R Recommended location of thermal grease application Approx location f...

Страница 143: ...ut should be smaller than 0 150 in diameter Make sure there is no contact between the thermocouple cement and heatsink base This contact will affect the thermocouple reading 10 2 2 2 COVER TEMPERATURE...

Страница 144: ...cement 10 3 THERMAL SOLUTION ATTACH METHODS The design of the thermal plate is intended to support two different attach methods heatsink clips and Rivscrews Figure 11 4 and Figure 11 6 show the therma...

Страница 145: ...rmal plate The clearance of the thermal plate to the internal processor substrate is a minimum 0 125 illustrated in Figure 10 7 Figure 10 8 and Figure 10 6 The clips should be designed such that they...

Страница 146: ...s Processor Core 0 089 Max Depth 000877a Figure 10 7 Processor with an Example Low Profile Heatsink Attached using Spring Clips 0 089 Max Depth Thermal Plate Spring Clip Cover Processor Substrate All...

Страница 147: ...gure 10 11 for details of heatsink requirements for use with Rivscrews For other heatsink base thicknesses contact your vendor for other Rivscrew parts that would be required 3 0 Maximum Total Heatsin...

Страница 148: ...THERMAL SPECIFICATIONS AND DESIGN CONSIDERATIONS E 10 10 Y X H ole is 4 x 0 150 0 005 0 305 Heatsink A ll dimensions in inches 000903a Figure 10 11 General Rivscrew Heatsink Mechanical Recommendations...

Страница 149: ...E 11 S E C Cartridge Mechanical Specifications...

Страница 150: ......

Страница 151: ...II processor s thermal plate and latch arms Figure 11 9 through Figure 11 12 provide details of the Pentium II processor s substrate and markings The processor edge connector defined in this document...

Страница 152: ...UGH FIGURE 11 12 Unless otherwise specified the following drawings are dimensioned in inches All dimensions provided with tolerances are guaranteed to be met for all normal production product Figures...

Страница 153: ...CARTRIDGE MECHANICAL SPECIFICATIONS 11 3 Skirt Left Latch Arm Right Latch Arm Cover Thermal Plate Right Latch Arm Left Latch Arm Cover 000893a Figure 11 1 S E C Cartridge Thermal Plate and Cover Side...

Страница 154: ...S E C CARTRIDGE MECHANICAL SPECIFICATIONS E 11 4 001055a Figure 11 2 S E C Cartridge Top and Side Views...

Страница 155: ...E S E C CARTRIDGE MECHANICAL SPECIFICATIONS 11 5 001054a Figure 11 3 S E C Cartridge Bottom Side View...

Страница 156: ...2 473 0 016 2 070 0 020 These dimensions are from the bottom of the substrate edge fingers 001053a Figure 11 4 S E C Cartridge Thermal Plate Side Dimensions 2 50 1 25 0 001 1 000 x 1 000 001052a NOTE...

Страница 157: ...E S E C CARTRIDGE MECHANICAL SPECIFICATIONS 11 7 000312JBM Figure 11 6 S E C Cartridge Thermal Plate Attachment Detail Dimensions...

Страница 158: ...IFICATIONS E 11 8 2X 0 174 0 005 2X 0 488 0 010 2X 0 238 0 010 2X 0 103 0 005 2X 0 647 0 015 2X 0 253 0 010 2X 0 058 0 005 2X 0 136 0 005 Left 001056a Figure 11 7 S E C Cartridge Latch Arm Thermal Pla...

Страница 159: ...084 0 060 0 122 0 075 R 0 015 0 060 0 055 0 316 0 058 0 277 0 116 0 291 Detail C Detail D Detail E 45 0 120 Min 0 082 0 276 0 216 001057a NOTE All dimensions without tolerance information are conside...

Страница 160: ...imensions without tolerance information are considered reference dimensions only Figure 11 9 S E C Cartridge Substrate Dimensions Skirt not shown for clarity Pin B121 Pin B1 Substrate Cover NOTE Cover...

Страница 161: ...1 X 0 016 0 002 0 045 0 236 0 074 0 002 20 008 L Z W M 05 002 Pad to Pad 121 X 0 043 0 002 20 008 L Z W M 05 002 Pad to Pad L L 0 356 Min 0 138 Min 0 008 0 010 001060b NOTE All dimensions without tole...

Страница 162: ...R O C E S S O R Dynamic Mark Area pentium II P R O C E S S O R with MMX technology pentium II P R O C E S S O R with MMX technology 000978a Figure 11 12 S E C Cartridge Mark Locations Processor Markin...

Страница 163: ...MOS Input A9 TDI JTAG Input B9 VCC_VTT GTL VTT Supply A10 GND VSS B10 TMS JTAG Input A11 TDO JTAG Output B11 TRST JTAG Input A12 PWRGOOD CMOS Input B12 Reserved Reserved for Future Use A13 TESTHI CMOS...

Страница 164: ...VSS B34 D 56 GTL I O A35 D 60 GTL I O B35 D 50 GTL I O A36 D 53 GTL I O B36 D 54 GTL I O A37 D 57 GTL I O B37 VCC_CORE Processor Core VCC A38 GND VSS B38 D 59 GTL I O A39 D 46 GTL I O B39 D 48 GTL I O...

Страница 165: ...O B61 EMI EMI Management A62 GND VSS B62 D 20 GTL I O A63 D 13 GTL I O B63 D 17 GTL I O A64 D 11 GTL I O B64 D 15 GTL I O A65 D 10 GTL I O B65 VCC_CORE Processor Core VCC A66 GND VSS B66 D 12 GTL I O...

Страница 166: ...e Use B88 A 25 GTL I O A89 A 19 GTL I O B89 VCC_CORE Processor Core VCC A90 GND VSS B90 A 15 GTL I O A91 A 18 GTL I O B91 A 17 GTL I O A92 A 16 GTL I O B92 A 11 GTL I O A93 A 13 GTL I O B93 VCC_CORE P...

Страница 167: ...T GTL I O A111 DBSY GTL I O B111 RS 2 GTL Input A112 RS 1 GTL Input B112 Reserved Reserved for Future Use A113 Reserved Reserved for Future Use B113 VCC_L2 Other VCC A114 GND VSS B114 RP GTL I O A115...

Страница 168: ...35 GTL I O A96 A 10 GTL I O A5 A20M CMOS Input B92 A 11 GTL I O A115 ADS GTL I O B94 A 12 GTL I O B118 AERR GTL I O A93 A 13 GTL I O A117 AP 0 GTL I O A95 A 14 GTL I O B116 AP 1 GTL I O B90 A 15 GTL I...

Страница 169: ...10 GTL I O A49 D 37 GTL I O A64 D 11 GTL I O B50 D 38 GTL I O B66 D 12 GTL I O A045 D 39 GTL I O A63 D 13 GTL I O B47 D 40 GTL I O A67 D 14 GTL I O B42 D 41 GTL I O B64 D 15 GTL I O A043 D 42 GTL I O...

Страница 170: ...A111 DBSY GTL I O A34 GND VSS A105 DEFER GTL Input A38 GND VSS A25 DEP 0 GTL I O A042 GND VSS A27 DEP 1 GTL I O A46 GND VSS B26 DEP 2 GTL I O A50 GND VSS A28 DEP 3 GTL I O A54 GND VSS B27 DEP 4 GTL I...

Страница 171: ...2 GTL Input B106 LOCK GTL I O B115 RSP GTL Input B18 PICCLK APIC Clock Input B101 SLOTOCC GND A19 PICD 0 CMOS I O B8 SLP CMOS Input B22 PICD 1 CMOS I O B3 SMI CMOS Input B23 PRDY GTL Output B6 STPCLK...

Страница 172: ...C_L2 Other VCC B53 VCC_CORE Processor Core VCC A1 VCC_VTT GTL VTT Supply B57 VCC_CORE Processor Core VCC A3 VCC_VTT GTL VTT Supply B65 VCC_CORE Processor Core VCC B5 VCC_VTT GTL VTT Supply B69 VCC_COR...

Страница 173: ...E 12 Boxed Processor Specifications...

Страница 174: ......

Страница 175: ...otherboard and system requirements for the fan heatsink that will be supplied with the Boxed Pentium II processor This chapter is particularly important for OEMs that manufacture motherboards for syst...

Страница 176: ...ICATIONS This section documents the mechanical specifications of the Boxed Pentium II processor fan heatsink 12 2 1 Boxed Processor Fan Heatsink Dimensions The Boxed processor ships with an attached f...

Страница 177: ...nnector Fan Heatsink S E C Cartridge Cover 000890a Figure 12 2 Side View Space Requirements for the Boxed Processor Fan heatsink supports not shown 4 90 Max D 1 25 2 19 C Power Cable Connector 000891a...

Страница 178: ...t The Boxed processor fan heatsink will not weigh more than 225 grams See Chapter 10 and Chapter 11 for details on the processor weight and heatsink requirements 12 2 3 Boxed Processor Retention Mecha...

Страница 179: ...n Table 12 2 Boxed Processor Fan Heatsink Support Dimensions Fig Ref Label Dimensions Inches Min Typ Max G Fan Heatsink support height 2 261 H Fan Heatsink support clearance above motherboard 0 430 J...

Страница 180: ...Thru 0 187 Thru 2X Recommendations 0 300 dia trace keepout all external layers 0 250 dia trace keepout all internal layers All dimensions in inches 1 769 Slot 1 Connector 1 950 2 932 000875a Figure 12...

Страница 181: ...E BOXED PROCESSOR SPECIFICATIONS 12 7 2 261 G 0 275 DIA J 0 300 MAX 0 240 K 1 769 0 060 L 0 060 M 0 430 H 000804a Figure 12 6 Side View Space Requirements for Boxed Processor Fan Heatsink Supports...

Страница 182: ...he cable length is 7 0 inches 0 25 The fan heatsink outputs a SENSE signal which is an open collector output that pulses at a rate of two pulses per fan revolution A motherboard pull up resistor provi...

Страница 183: ...header on motherboard Waldom Molex P N 22 23 2031 AMP P N 640456 3 or equivalent 1 2 3 GND 12V SENSE 1 2 3 000888 Figure 12 8 Boxed Processor Fan Heatsink Power Cable Connector Description Table 12 3...

Страница 184: ...ized by the Boxed processor 12 4 1 Boxed Processor Cooling Requirements The Boxed processor is cooled with a fan heatsink The Boxed processor fan heatsink will keep the thermal plate temperature TPLAT...

Страница 185: ...E 13 Integration Tools...

Страница 186: ......

Страница 187: ...arget Probe ITP for the Pentium II processor is a debug tool which allows access to on chip debug features via a small port on the system board called the debug port The ITP communicates to the proces...

Страница 188: ...oard footprint The connectors are manufactured by AMP Incorporated and are in the AMPMODU System 50 line Following are the AMP part numbers for the two connectors Amp 30 pin shrouded vertical header 1...

Страница 189: ...e entire target system The signal should be pulled up Intel recommends a 240 resistor but system designers will need to fine tune specific system designs to meet two considerations 1 the signal must b...

Страница 190: ...or to Vcc2 5 at the point furthest from the debug port Poor routing can cause multiple clocking problems usually on falling edge of TCK Should be routed to all components in the boundary scan chain3 F...

Страница 191: ...es requests to P0 to enter debug Add 150 to 330 ohm pull up resistor to Vcc2 5 PRDY0 18 PRDY0 signal driven by P0 informs ITP that P0 is ready for debug Terminate 2 signal properly at the debug port D...

Страница 192: ...close as possible to the value specified 2 Termination should include a series 240 ohms and pull up connected to 1 5V resistors 3 Signal should be at end of daisy chain and the boundary scan chain sho...

Страница 193: ...he number of loads on the TCK signal special care should be taken when routing it Poor routing can lead to multiple clocking of some agents on the debug chain usually on the falling edge of TCK This c...

Страница 194: ...ts of data via boundary scan Additionally removing all but the processors from the boundary scan chain reduces the possibility for errors in the chain when using the ITP for system debug If the system...

Страница 195: ...0 PREQ0 TDO TDI PRDY1 PREQ1 TDO BCLK BCLK TDO PREQ3 PRDY3 PREQ2 PRDY2 TCK TMS TRST BSEN DBRESET PREQ0 PRDY0 TDI DBINST POWERON PREQ1 PRDY1 RESET BCLK NOTE See Table 13 1 for recommended resistor value...

Страница 196: ...lugged into the connector 13 1 5 2 DEBUG PORT CONNECTOR Figure 13 7 and Figure 13 8 illustrate how the debug port connector should be installed on a circuit board Note the way the pins are numbered on...

Страница 197: ...TDI TDO PCIset PCIset 000799b Figure 13 9 Processor System where Boundary Scan is Not Used 13 2 INTEGRATION TOOL CONSIDERATIONS 13 2 1 Integration Tool Mechanical Keepouts An integration tool LAI562 h...

Страница 198: ...s on the target system However due to the current limitations of some signal drivers this stronger value may not be feasible Calculation of the correct pull up resistor value for each of the CMOS sign...

Страница 199: ...Edge Connector 0 025 Thermal Plate Side View All dimensions in inches 2 8 Integration Tool Volume 1 375 3 3 Cable continues up 000839c Figure 13 11 Pentium II Processor Integration Tool Mechanical Kee...

Страница 200: ...14 PCB Slot 1 Edge Connector 0 025 Cover Side View All dimensions in inches 2 25 1 375 1 375 1 7 Integration Tool Volume 000840b Figure 13 12 Pentium II Processor Integration Tool Mechanical Keep Out...

Страница 201: ...RATION TOOLS 13 15 Side View All dimensions in inches PCB 0 35 2 00 0 15 1 7 0 65 0 385 Cable continues upward 000838b Figure 13 13 Pentium II Processor Integration Tool Mechanical Keep Out Volume Sid...

Страница 202: ......

Страница 203: ...E 14 Advanced Features...

Страница 204: ......

Страница 205: ...oftware operating system kernels virtual memory managers BIOS and processor test software performance monitoring tools For software developers designing other categories of software this information d...

Страница 206: ......

Страница 207: ...E A Signals Reference...

Страница 208: ......

Страница 209: ...power on configuration A 1 2 A20M I If the A20M Address 20 Mask input signal is asserted the Pentium II processor masks physical address bit 20 A20 before looking up a line in any internal cache and...

Страница 210: ...o the Machine Check Architecture MCA of the system A 1 5 AP 1 0 I O The AP 1 0 Address Parity signals are driven by the request initiator along with ADS A 35 3 REQ 4 0 and RP AP1 covers A 35 24 and AP...

Страница 211: ...h was in transit is lost All agents reset their rotating ID for bus arbitration to the state after reset and internal count information is lost The L1 and L2 caches are not affected If BINIT observati...

Страница 212: ...all of its requests are completed then releases the bus by deasserting BPRI A 1 13 BR0 I O BR1 I The BR0 and BR1 Bus Request pins drive the BREQ 1 0 signals in the system The BREQ 1 0 signals are int...

Страница 213: ...he transfer order called burst order A line is transferred in four eight byte chunks each of which can be identified by address bits 4 3 The chunk size is 64 bits Table A 3 specifies the transfer orde...

Страница 214: ...ctions A 1 16 DBSY I O The DBSY Data Bus Busy signal is asserted by the agent responsible for driving data on the Pentium II processor system bus to indicate that the data bus is in use The data bus i...

Страница 215: ...LUSH is an asynchronous signal However to ensure recognition of this signal following an I O write instruction it must be valid along with the TRDY assertion of the corresponding I O Write bus transac...

Страница 216: ...nsaction may optionally be converted to an external error signal e g NMI by system core logic The processor will keep IERR asserted until it is handled in software or with the assertion of RESET BINIT...

Страница 217: ...oth signals are asynchronous Both of these signals must be software configured via BIOS programming of the APIC register space to be used either as NMI INTR or LINT 1 0 Because the APIC is enabled by...

Страница 218: ...rocessor and core logic or I O APIC which is required for operation of all processors core logic and I O APIC components on the APIC bus During FRC mode operation PICCLK must be 1 4 of and synchronous...

Страница 219: ...h specification in Table 7 12 and be followed by a 1 ms RESET pulse The PWRGOOD signal must be supplied to the processor as it is used to protect internal circuits against voltage sequencing issues Th...

Страница 220: ...t parity signal is high if an even number of covered signals are low and low if an odd number of covered signals are low This definition allows parity to be high when all covered signals are high A 1...

Страница 221: ...of the SLP STPCLK and RESET signals while in Sleep state If SLP is deasserted the processor exits Sleep state and returns to Stop Grant state restarting its internal clock signals to the bus and APIC...

Страница 222: ...cessor protects itself from catastrophic overheating by use of an internal thermal sensor This sensor is set well above the normal operating temperature to ensure that there are no false trips The pro...

Страница 223: ...th a 680 pull down resistor A 1 55 VID 4 0 O The VID 4 0 Voltage ID pins can be used to support automatic selection of power supply voltages These pins are not signals but are either an open circuit o...

Страница 224: ...ut and I O signals Table A 5 Output Signals 1 Name Active Level Clock Signal Group FERR Low Asynch CMOS Output IERR Low Asynch CMOS Output PRDY Low BCLK GTL Output SLOTOCC Low Asynch Power Other TDO H...

Страница 225: ...de NMI High Asynch CMOS Input APIC disabled mode PICCLK High APIC Clock Always PREQ Low Asynch CMOS Input Always PWRGOOD High Asynch CMOS Input Always RESET Low BCLK GTL Input Always RS 2 0 Low BCLK G...

Страница 226: ...0 Low BCLK GTL I O DRDY DBSY Low BCLK GTL I O Always DEP 7 0 Low BCLK GTL I O DRDY DRDY Low BCLK GTL I O Always FRCERR High BCLK GTL I O Always LOCK Low BCLK GTL I O Always REQ 4 0 Low BCLK GTL I O A...

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