Case Temperature Reference Metrology
R
82
Thermal/Mechanical Design Guide
8.
Place the processor under the microscope unit (similar to the one used in Figure 36) to
continue with the process. It is also recommended to use a fixture (like a processor tray or a
plate) to help hold the unit in place for the rest of the attach process.
9.
Press the wire down about 6 mm [0.125”] from the thermocouple bead using the tweezers.
Look in the microscope to perform this task. Place a piece of Kapton tape to hold the wire
inside the groove (Figure 33). Refer to Figure 34 for detailed bead placement.
Figure 33. Position Bead on the Groove Step
Figure 34. Detailed Thermocouple Bead Placement
10.
Using the micromanipulator, install the needle near to the end of the groove on top of the
thermocouple. Using the X, Y, and Z axes on the arm place the tip of the needle on top of the
thermocouple bead. Press down until the bead is seated at the end of the groove on top of the
step (see Figure 34 and Figure 35).
Wire section
into the
groove to
prepare for
final bead
placement
Kapton* tape
Содержание 640 - Pentium 4 640 3.2GHz 800MHz 2MB Socket 775 CPU
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Страница 97: ...Mechanical Drawings R Thermal Mechanical Design Guide 97 Figure 48 Reference Clip Drawings Sheet 1 ...
Страница 98: ...Mechanical Drawings R 98 Thermal Mechanical Design Guide Figure 49 Reference Clip Drawings Sheet 2 ...
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Страница 100: ...Mechanical Drawings R 100 Thermal Mechanical Design Guide Figure 51 Reference Fastener Sheet 2 ...
Страница 101: ...Mechanical Drawings R Thermal Mechanical Design Guide 101 Figure 52 Reference Fastener Sheet 3 ...
Страница 102: ...Mechanical Drawings R 102 Thermal Mechanical Design Guide Figure 53 Reference Fastener Sheet 4 ...
Страница 103: ...Mechanical Drawings R Thermal Mechanical Design Guide 103 Figure 54 Clip Heatsink Assembly ...
Страница 104: ...Mechanical Drawings R 104 Thermal Mechanical Design Guide Figure 55 Intel R RCBFH 3 Reference Solution Assembly ...
