Intel 640 - Pentium 4 640 3.2GHz 800MHz 2MB Socket 775 CPU, Руководство пользователя

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Introduction
R
12 Thermal/Mechanical Design Guide
1.3 Definition of Terms
Term Description
T
A
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan
inlet for an active heatsink.
T
C
The case temperature of the processor, measured at the geometric center of the
topside of the IHS.
T
E
The ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets.
T
S
Heatsink temperature measured on the underside of the heatsink base, at a location
corresponding to
T
C
.
T
C-MAX
The maximum case temperature as specified in a component specification.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
C
– T
A
) / Total Package
Power.
Note: Heat source must be specified for
Ψ
measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
C
– T
S
) / Total Package
Power.
Note: Heat source must be specified for
Ψ
measurements.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
A
) / Total Package Power.
Note: Heat source must be specified for
Ψ
measurements.
TIM
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
P
MAX
The maximum power dissipated by a semiconductor component.
TDP
Thermal Design Power: a power dissipation target based on worst-case applications.
Thermal solutions should be designed to dissipate the thermal design power.
IHS
Integrated Heat Spreader: A thermally conductive lid integrated into a processor
package to improve heat transfer to a thermal solution through heat spreading.
LGA775 Socket
The surface mount socket designed to accept the Pentium 4 processor in the 775–
land LGA package.
ACPI
Advanced Configuration and Power Interface.
Bypass
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
Thermal Monitor
A feature on the Pentium 4 processor in the 775–land LGA package that attempts to
keep the processor die temperature within factory specifications.
TCC
Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die temperature by
lowering effective processor frequency when the die temperature has exceeded its
operating limits.
T
DIODE
Temperature reported from the on-die thermal diode.