Memory DIMMs
Before performing the following procedure, read “Safety Notices” on page xi.
Memory DIMM Removal
To remove the memory DIMMs, do the following:
1. On a Model 6C4, open the front and rear rack doors and put the system into the
service position as described in “Placing the Model 6C4 into the Service Position”
On a Model 6E4, open the bezel door.
2. Shut down the system as described in “Stopping the System” on page 350.
3. Remove the service access cover as described in “Service Access Cover Removal
(Model 6C4)” on page 357 or “Service Access Cover Removal (Model 6E4)” on
page 363.
4. Remove the front bezel as described in “Front Bezel Removal (Model 6C4)” on
page 369 or “Front Bezel Removal (Model 6E4)” on page 370.
5. Disconnect all power and signal cables from the media drives, located in media
bay 1 and media bay 2, then remove the media drives as described in “Media
Removal” on page 399.
6. Remove the media device support shelf by loosening the thumbscrew and
grasping the back edge of the shelf, sliding it back, then lifting it up and out of the
system chassis.
Note: The support leg located on the bottom of the support shelf is used to
deactivate a microswitch. The microswitch is located on the CEC backplane
and when deactivated, cuts off power to many of the components and
connectors located on the CEC backplane. This support shelf must be
correctly seated and secured in position after any new FRU is added to the
system and you perform a system boot.
7. Before handling any card, board, or memory DIMM, touch any metal surface of the
chassis with one hand to minimize static electric discharge. Refer to “Handling
Static-Sensitive Devices” on page 348.
8. Grasp the end of both processor assembly release handles. Lift each handle until
it is perpendicular (90 degrees) to the top of the processor assembly. By placing
the handle perpendicular to the top of the processor assembly, the base or hinged
portion of each handle acts as a cam and will gently pry the processor card
connector from the docking connector located on the CEC backplane.
9. Remove the processor assembly from the system unit.
10. Lay the processor assembly, cover-side up, on a flat, static-protective surface.
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pSeries 630 Models 6C4 and 6E4 Service Guide
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