B&R Industries Automation PC 620, Руководство пользователя

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Technical data • Entire device
Automation PC 620 User's Manual V 1.90
2.5 Environmental temperatures for systems with an 855GME CPU board
It is possible to combine CPU boards with various other components, such as drives, main
memory, additional insert cards, etc. dependant on system unit and fan kit. The various
configurations result in varying maximum possible environmental temperatures, which can be
seen in the following graphic (see the figure, 16 "Environmental temperatures for systems with
an 855GME CPU board" on page 57).
Experience has shown that higher environmental temperatures can be reached under typical
conditions, e.g. using Microsoft Windows. The testing and evaluation is to be done on-site by the
user (temperatures can be read in BIOS or using the B&R Control Center, see Chapter 4
"Software" on page 205).
Worst-case conditions for systems with an 855GME CPU board
• Thermal Analysis Tool V1.4 from Intel for simulating 100% processor load.
• BurnIn testing tool (BurnIn V4.0 Pro from Passmark Software) to simulate a 100% load
on the interface via loop-back adapters (serial interfaces, add-on and slide-in drives, USB
interfaces, audio outputs).
• Maximum system extension and power consumption.
Information:
The maximum specified environmental temperatures were determined under worst-
case conditions.
Figure 15: Example of worst-case conditions for temperature measurement
PCI card(s)
CPU module
heat build-up
PCI cards
heat build-up
Slide-in drive(s)
CPU module
Add-on drive
main heat dissipation
via heat sink
View from above