Memory Interface
ARM DDI 0210C
Copyright © 2001, 2004 ARM Limited. All rights reserved.
3-23
Figure 3-17 Test chip data bus circuit
Note
At the core level,
TBE
and
DBE
are inactive, tied HIGH, because in a packaged part
you do not have to manually force the internal buses into a high impedance state. At the
pad level, the test chip signal
EDBE
is used by the bus control logic to enable the
external memory controller to arbitrate the bus and asynchronously disable the
ARM7TDMI core test chip if necessary.
Scan
cell
Scan
cell
Scan
cell
Vdd
Vss
Vdd
MCLK
DBE
nENOUT
nEDBE
MCLK
EDBE
nENIN
TBE
D[31:0]
XD[31:0]
Pad
ARM7TDMI core
ARM7TDMI test chip or product
nEN1
nEN2
Содержание ARM7TDMI
Страница 6: ...Contents vi Copyright 2001 2004 ARM Limited All rights reserved ARM DDI 0210C ...
Страница 10: ...List of Tables x Copyright 2001 2004 ARM Limited All rights reserved ARM DDI 0210C ...
Страница 14: ...List of Figures xiv Copyright 2001 2004 ARM Limited All rights reserved ARM DDI 0210C ...
Страница 46: ...Introduction 1 26 Copyright 2001 2004 ARM Limited All rights reserved ARM DDI 0210C ...
Страница 120: ...Coprocessor Interface 4 18 Copyright 2001 2004 ARM Limited All rights reserved ARM DDI 0210C ...
Страница 142: ...Debug Interface 5 22 Copyright 2001 2004 ARM Limited All rights reserved ARM DDI 0210C ...
Страница 276: ...Differences Between Rev 3a and Rev 4 C 6 Copyright 2001 2004 ARM Limited All rights reserved ARM DDI 0210C ...
Страница 282: ...Glossary Glossary 6 Copyright 2001 2004 ARM Limited All rights reserved ARM DDI 0210C ...