DRS27 User’s Guide
Chapter 4: Software Overview
0025.00.902
4-34
Remove: Component Removal – Board Carrier
Function:
Process used to activate vacuum sensor, force based, shear or object detection removal
procedures to remove component from board.
Action:
Most common sequence – vacuum sensor stop (use vacuum sensor stop). The nozzle moves
up (sensor stabilize height) after the component heating events. The nozzle vacuum is turned on and its
vacuum force measurement is recorded for reference. The nozzle moves down until the nozzle vac-
uum force (internal parameter) is reached (or force system (place target)). The nozzle moves up (de-
part height).
Task Properties:
Approach Height (mm):
Position for nozzle to internally calibrate vacuum sensor. Height is based on
distance from board carrier.
Note: Sufficient air passage is critical.
Use Vacuum Sensor Stop:
Stops downward movement based on vacuum change.
Pick Velocity:
Speed of nozzle moving down.
Safety Target (gram):
Maximum force as backup.
(+) Theta Move (deg):
Nozzle will rotate clockwise to set angle.
( - ) Theta Move (deg):
Nozzle will rotate counterclockwise to set angle.
Depart Height (mm):
Sets distance of the component to the board after place target is reached.
Depart Delay (sec):
Time between nozzle vacuum activates and motion prior to component removal
(for any of the defined procedures).
Move to Safe Height:
Moves nozzle automatically above the vision system.
Depart Velocity (%):
Speed of nozzle depart.
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