Air-Vac DRS27, Руководство пользователя

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DRS27 User’s Guide Chapter 1: Introduction/Overview
0027.00.902 1-16
1.6 Options Overview
1.6.1 Site Cleaning System (0029.03.012)
Objective
•
Fully automated removal of residual site solder without
damaging the pads or solder mask. Eliminates the need for
traditional solder iron/solder wick process and associated
issues (ie. manual intervention, mechanical contact of
pads).
How It Works:
•
Hot gas reflows the residual solder on the pads.
•
While viewing through the microscope, the operator moves
the board with the x/y adjustment wheels to clean the pads
on the site.
•
A vacuum sensor continuously adjusts the height of the
composite vacuum tip to provide non-contact site cleaning.
Notes Of Interest:
•
Non-contact site cleaning will become critical for lead-free
rework due to the significantly higher temperature required
to reflow the residual site solder.
•
Small, medium and large composite vacuum tips provided.
•
Custom designs available for hard to access areas.
1.6.2 Pivoting IR Probe with Laser Pointer (0029.11.043)
Objective
•
Provides process repeatability by in-
suring that the board is at the exact
same target temperatures each time
before localized reflow begins.
How It Works:
•
Operator is instructed to position the
sensor head at the beginning of the
process.
•
The non-contact temperature sensor
monitors topside board temperature
and automatically triggers the local-
ized reflow process once the target
temperature is reached.