5 Operations After Start of Probing
5-4
5.3 Confirmation and Correction of Probe Mark Position
Contact height manual adjustment screen
Contact height manual adjustment screen
X, Y : Image center position from wafer center
Z : Current height from chuck origin
T : Card degree against wafer at the time of
wafer alignment
C : Die coordinate value under camera
DX, DY : Distance from lower left corner of the die
of the pad under cross mark
Site No : Target side number of the die under camera
Image center cross mark
Probe mark checking screen
To correct the subsequent needle positions while
executing lot processing, bring up the needle height
determination manual operation screen, and touch
the <IMAGE DISPLAY CHANGE> button two times.
The chuck moves to below the alignment camera,
and the needle confirmation screen is displayed.
At the center of the needle mark confirmation
screen shown on the left, the pad with serial No. 1
is displayed in high magnification by the die of site
No. 1 tested last time.
To confirm the needle mark of other pad, adjust the
die position using the direction key.
Using the multi-site measurement card, the needle
tip mark of other site can be confirmed by operating
the direction key in the index mode. At this point,
Site No. on the upper left of the screen is changed.
To correct the needle mark position, touch the
<NEEDLE ALIGN POSI CORRECT> button two
times. The screen changes as shown in the figure
on the lower left.
By touching the <DATA-IN> adjusting the needle
mark center to the cross mark through use of the
direction key, X/Y correction amount at this point is
displayed in place of the image center position from
the wafer center, and the needle mark confirmation
screen returns.
When X or Y correction amount exceeds 50 µm, an
error results. In this case, release the error using
<DATA-IN> or <CANCEL>, and adjust the
correction amount to within 50 µm.
Touching the <EXIT> button in the needle mark
confirmation screen, the map display screen or
prober status display screen returns.
