3 Automatic Needle Alignement
3-22
3.4.1 Execution of the automatic contact height determination
At completion of the automatic contact height
determination
In case that the contact height is determined from
the calculation of the probe tip height data obtained
in the high magnification pad alignment process,
the determination is made in an instant and the
display directly changes to the screen shown in the
lower left.
With the Basic Operational parameter "Confirm of
Auto Needle Height Adjustment" set to "1: Yes",
when the contact height determination has finished,
the display changes to the screen shown left. (If this
stop is not demanded with the parameter, probing
starts according to the preset wafer map with the
preset overdrive amount immediately.)
For checking the probe marks on pads that can be
made according to the probe-pad alignment
procedure, push
Z DRIVE
switch once; Chuck is
driven up over the contact height by the preset
overdrive amount to make the probe marks on the
pads.
In order to confirm the probe marks, push <Image
Display Change> button
twice
; Chuck moves to
position the probe-contacted die below the wafer
alignment camera for the probe mark visual check.
(For the checking and fine adjustment procedure,
see the next section Checking Probe Marks.)
