4 Wafer Mapping & Die Sampling
4.1
Operation Flow Chart .........................................................4-2
4.2
Test Die Area Setting ..........................................................4-3
4.2.1
Setting the test die area ..................................................................4-5
4.3
Reference Die Setting.........................................................4-6
4.3.1
Target sensing .................................................................................4-8
4.3.2
Difference between TEG and corner targets...............................4-10
4.3.3
Setting the reference die...............................................................4-12
4.4 Die
Attribute
Setting..........................................................4-13
4.5
Sampling Dice Setting ......................................................4-15
4.5.1
Performing data-in for sample dice .............................................4-17
